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Proceedings of SPIE Volume 1390

Microelectronic Interconnects and Packages: System and Process Integration
Editor(s): Stuart K. Tewksbury; John R. Carruthers
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*Available as a photocopy reprint only. Allow two weeks reprinting time plus standard delivery time. No discounts or returns apply.


Volume Details

Volume Number: 1390
Date Published: 1 April 1991
Softcover: 43 papers (592) pages
ISBN: 9780819404572

Table of Contents
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Packaging technology for the NEC SX-3 supercomputers
Author(s): Hiroshi Murano; Toshihiko Watari
Advanced multichip module packaging and interconnect issues for GaAs signal processors operating above 1 GHz clock rates
Author(s): Barry K. Gilbert; R. Thompson; Gregg Fokken; W. McNeff; Jeffrey A. Prentice; David O. Rowlands; A. Staniszewski; Wes Walters; S. Zahn; George W. Pan
Skin effect in high-speed ULSI/VLSI packages
Author(s): Lih-Tyng Hwang; Iwona Turlik
Modeling progress and trends in electrical interconnects
Author(s): John L. Prince; Andreas C. Cangellaris; Olgierd A. Palusinski
Photonic Multichip Packaging (PMP) using electro-optic organic materials and devices
Author(s): John F. McDonald; Nickolas P. Vlannes; Toh-Ming Lu; Gary E. Wnek; Theodore C. Nason; Lu You
System issues for multichip packaging
Author(s): Maurice G. Sage; Neil Hartley
Fractal description of computer interconnections
Author(s): Phillip Christie; Stephen B. Styer
Power economy using point-to-point optical interconnect links
Author(s): Davis H. Hartman; Leslie A. Reith; Sarry F. Habiby; Gail R. Lalk; Bruce L. Booth; Joseph E. Marchegiano; James L. Hohman
Chaotic nature of mesh networks with distributed routing
Author(s): Andrzej Rucinski; Peter G. Drexel; Barbara Dziurla
Pipelined communications on optical busses
Author(s): Zicheng Guo; Rami G. Melhem; Richard W. Hall; Donald M. Chiarulli; Steven Peter Levitan
Current status and future research of the Delft 'supercomputer' project
Author(s): Edward E. E. Frietman; L. Dekker; W. van Nifterick; Piet M. A. Demeester; Peter Van Daele; W. Smit
All-optical interconnection networks
Author(s): Arif Ghafoor
Computer-Aided System Interconnect Design (CASID) in multipackage environment
Author(s): N. S. Chandrasehekaran; V. Sundari; Jacob V. Vengal; P. N. A. P. Rao
Interactive Design and Electro-optic Analysis Liaise (IDEAL)
Author(s): Talib A. S. Alukaidey; Alvin A. Pettiford
Flow behavior of thermoset molding compound in conventional PDIP molds
Author(s): Marcelo S. Gonzalez; Manolo G. Mena
High-density interconnect technology for VAX 9000 system
Author(s): Ujwal A. Deshpande; Gelston Howell; Shamouil Shamouilian
Methods for comparative analysis of waveform degradation in electrical and optical high-performance interconnections
Author(s): Henri Merkelo; B. D. McCredie; M. S. Veatch; D. L. Quinn; M. Dorneich; Yutaka Doi

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