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Proceedings of SPIE Volume 1389

Microelectronic Interconnects and Packages: Optical and Electrical Technologies
Editor(s): Gnanalingam Arjavalingam; James Pazaris
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Volume Details

Volume Number: 1389
Date Published: 1 April 1991
Softcover: 59 papers (684) pages
ISBN: 9780819404565

Table of Contents
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Interconnection problems in VLSI random access memory chip
Author(s): Venkatapathi Naidu Rayapati; Dinkar Mukhedkar
Design and process impact on thin-film interconnection performance
Author(s): Glenn A. Rinne; Lih-Tyng Hwang; Gretchen M. Adema; Donald A. King; Iwona Turlik
V-line: a new interconnect for packaging and microwave applications
Author(s): Jose E. Schutt-Aine; Jin-Fa Lee
Multidisciplinary analysis and design of printed wiring boards
Author(s): Robert E. Fulton; Joseph L.A. Hughes; Waymond R. Scott; Charles Umeagukwu; Chao-Pin Yeh
Electrical characteristics of lossy interconnections for high-performance computer applications
Author(s): Alina Deutsch; Gerard V. Kopcsay; V. A. Ranieri; J. K. Cataldo; E. A. Galligan; W. S. Graham; R. P. McGouey; S. L. Nunes; Jurij R. Paraszczak; J. J. Ritsko; R. J. Serino; D. Y. Shih; Janusz S. Wilczynski
Switching noise in a medium-film copper/polyimide multichip module
Author(s): Peter A. Sandborn; Seyed Hassan Hashemi; William Weigler
Sensitivity study of printed wiring board plated-through-holes copper barrel voids
Author(s): Chao-Pin Yeh; Charles Umeagukwu; Robert E. Fulton; William Teat
Measurements and characterization of multiple-coupled interconnection lines in hybrid and monolithic integrated circuits
Author(s): Leonard A. Hayden; Jyh-Ming Jong; John B. Rettig; Vijai K. Tripathi
Novel microstructures for low-distortion chip-to-chip interconnects
Author(s): Heinrich C. Blennemann; Roger Fabian W. Pease
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Application of electrodeposition processes to advanced package fabrication
Author(s): Sol Krongelb; John O. Dukovic; M. L. Komsa; S. Mehdizadeh; Lubomyr T. Romankiw; Panayotis C. Andricacos; A. T. Pfeiffer; Kason Wong
Frequency domain evaluation of the accuracy of lumped element models for RLC transmission lines
Author(s): William Delbare; Tom Dhaene; Luc Vanhauwermeiren; Daniel De Zutter
Effects of conductor losses on cross-talk in multilevel-coupled VLSI interconnections
Author(s): T. Emilie van Deventer; Linda P.B. Katehi; Andreas C. Cangellaris
Efficient and accurate dynamic analysis of microstrip integrated circuits
Author(s): Tawfik Rahal Rahal Arabi; Arthur T. Murphy; Tapan K. Sarkar
Overview of optical interconnect technology
Author(s): George Liang-Tai Chiu; Modest M. Oprysko
Potential roles of optical interconnections within broadband switching modules
Author(s): Gail R. Lalk; Sarry F. Habiby; Davis H. Hartman; Robert R. Krchnavek; Donald K. Wilson; Kenneth C. Young
Vertical cavity lasers for optical interconnects
Author(s): Jack L. Jewell; Yong H. Lee; Samuel L. McCall; Axel Scherer; James P. Harbison; Leigh T. Florez; N. Anders Olsson; Rodney S. Tucker; Charles A. Burrus; Claude J. Sandroff
Vertical 3-D integration of silicon waveguides in a Si-SiO2-Si-SiO2-Si structure
Author(s): Richard A. Soref; Fereydoon Namavar; Elisabetta Cortesi; Lionel R. Friedman; Richard Lareau
Asymmetric Fabry-Perot modulators for optical signal processing and optical computing applications
Author(s): Michael Kevin Kilcoyne; Mark Whitehead; Larry A. Coldren
Compact PIN-amplifier module for giga bit rates optical interconnection
Author(s): Tomihiro Suzuki; Yasuki Mikamura; Kazuo Murata; Takeshi Sekiguchi; Nobuo Shiga; Yasunori Murakami
Time-division optical microarea networks
Author(s): Paul R. Prucnal; Steven T. Johns; Mark F. Krol; John L. Stacy
High-speed optical interconnects for parallel processing and neural networks
Author(s): Nigel Barnes; Peter Healey; Paul McKee; Alan O'Neill; Marek A. Rejman-Greene; Geoff Scott; David W. Smith; Roderick P. Webb; David Wood
Free-space optical interconnect using microlasers and modulator arrays
Author(s): Alex G. Dickinson; Maralene M. Downs; R. E. LaMarche; Michael E. Prise
Electro-optic polymer devices for optical interconnects
Author(s): Richard S. Lytel; Edward S. Binkley; Dexter G. Girton; John T. Kenney; George F. Lipscomb; Anthony J. Ticknor; Timothy E. Van Eck
Proposed electro-optic package with bidirectional lensed coupling
Author(s): K. Rajasekharan; Timothy Michalka
Intercircuit optical interconnects using quantum-well modulators
Author(s): Robert C. Goodfellow; Martin J. Goodwin; Andrew J. Moseley
Interconnection requirements in avionic systems
Author(s): Claude Vergnolle; Bruno Houssay
Optical receivers in ECL for 1GHz parallel links
Author(s): Joerg B. Wieland; Hans M. Melchior
Holographic optical elements for free-space clock distribution
Author(s): Helmut Zarschizky; Holger Karstensen; Christian Gerndt; Ekkehard Klement; Hartmut W. Schneider
Silicon-on-silicon microsystem in plastic packages
Author(s): Agneta Novak; Anders Glaes; Claes Blom; Hans Hentzell; Charles Hodges; Farzeen Kalhur

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