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PROCEEDINGS VOLUME 11178 • new

Photomask Japan 2019: XXVI Symposium on Photomask and Next-Generation Lithography Mask Technology
Editor(s): Akihiko Ando
For the purchase of this volume in printed format, please visit Proceedings.com

Volume Details

Volume Number: 11178
Date Published: 9 July 2019

Table of Contents
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Front Matter: Volume 11178
Author(s): Proceedings of SPIE
FPGA capability expansion despite technology challenges
Author(s): Nui Chong; Xin Wu
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Design and investigation of a maskless lithography system for printing patterns on the inside surface of a long pipe
Author(s): Toshiyuki Horiuchi; Kousuke Akitani; Kazumi Imahashi; Yuta Suzuki; Jun-ya Iwasaki; Hiroshi Kobayashi; Akira Yanagida
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Improvement study of Mitsui SOC materials for multilayer lithography process
Author(s): Keisuke Kawashima; Koji Inoue; Kenichi Fujii; Takashi Oda; Kazuo Kohmura
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Research on photomask process for FPD
Author(s): Kouichi Murakami; Takumi Uemura; Shuichi Ojima
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ASML NXE pellicle update
Author(s): Derk Brouns; Par Broman; Jan-Willem van der Horst; Raymond Lafarre; Raymond Maas; Theo Modderman; Roel Notermans; Guido Salmaso
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Evaluation of local CD and placement distribution on EUV mask and its impact on wafer
Author(s): Vidya Vaenkatesan; Paul van Adrichem; Marleen Kooiman; Michael Kubis; Lieve van Look ; Andreas Frommhold; Emily Gallagher; DS Nam; Jan Mulkens
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MPC model sensitivity analysis: model ambit vs. correction runtime
Author(s): Alex Zepka; John Valadez; Parikshit Kulkarni; Kohei Yanagisawa; Kota Kobayashi; Kiyoshi Kageyama
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How curvilinear mask patterning will enhance the EUV process window: a study using rigorous wafer+mask dual simulation
Author(s): Ryan Pearman; Jeff Ungar; Nagesh Shirali; Abhishek Shendre; Mariusz Niewczas; Leo Pang; Aki Fujimura
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How GPU-accelerated simulation enables applied deep learning for masks and wafers
Author(s): Linyong Pang; Mariusz Niewczas; Mike Meyer; Ryan Pearman; Abhishek Shendre; Aki Fujimura
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Development of massive parallel electron beam write system
Author(s): Masayoshi Esashi; Hiroshi Miyaguchi; Akira Kojima; Naokatsu Ikegami; Nobuyoshi Koshida; Masanori Sugata; Hideyuki Ohyi
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Open issues in mask technology as EUV enters high volume manufacturing
Author(s): Moshe Preil; James W. Westphal
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The study of relationship between defect sensitivity and inspectability on EUV masks with 19x nm mask inspection
Author(s): Masashi Yonetani; Karen Badger; Jed Rankin; Shinji Akima; Yusuke Toda; Itaru Yoshida; Masayuki Kagawa; Takeshi Isogawa; Yutaka Kodera; Jan Heumann; Anka Birnstein
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Lifetime test on EUV photomask with EBL2
Author(s): Chien-Ching Wu; Markus Bender; Rik Jonckheere; Frank Scholze; Herman Bekman; Michel van Putten; Rory de Zanger; Rob Ebeling; Jeroen Westerhout; Kyri Nicolai; Jacqueline van Veldhoven; Véronique de Rooij-Lohmann; Olaf Kievit; Alex Deutz
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Mask absorber development to enable next-generation EUVL
Author(s): Vicky Philipsen; Kim Vu Luong; Karl Opsomer; Laurent Souriau; Jens Rip; Christophe Detavernier; Andreas Erdmann; Peter Evanschitzky; Christian Laubis; Philipp Hönicke; Victor Soltwisch; Eric Hendrickx
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Ion beam etch for the patterning of advanced absorber materials for EUV masks
Author(s): Katrina Rook; Narasimhan Srinivasan; Vincent Ip; Meng Lee; Tania Henry
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Functional flatness impact targets (Key Performance Indicators) for the high-volume manufacturing of EUV photomask blanks
Author(s): David L. Aronstein; Katherine Ballman; Christopher Lee; John Zimmerman
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The advantages of nanoimprint lithography for semiconductor device manufacturing
Author(s): Toshiya Asano; Keita Sakai; Kiyohito Yamamoto; Hiromi Hiura; Takahiro Nakayama; Tomohiko Hayashi; Yukio Takabayashi; Takehiko Iwanaga; Douglas J. Resnick
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Status of overlay performance for NIL high volume manufacturing
Author(s): Tatsuya Hayashi; Yukio Takabayashi; Mitsuru Hiura; Takehiko Iwanaga; Hiroshi Morohoshi; Takamitsu Komaki
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Advanced laser repair of EUV photomasks
Author(s): Tod Robinson; Jeff LeClaire
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Deal gently with the bird you are trying to catch: small scale CD control with machine learning
Author(s): Christian Bürgel; Martin Sczyrba; Clemens Utzny
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A study of airborne molecular contamination to Cr etching process
Author(s): Yuan Hsu; Yutaka Satou; Heng-Jen Lee; Zack Huang
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Development of the breathable frame for closed EUV pellicle
Author(s): Akira Ishikawa; Hirofumi Tanaka; Yosuke Ono; Atsushi Okubo; Kazuo Kohmura
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EUV pellicle qualification on transmission and reflectance
Author(s): T. Missalla; A. Biermanns-Föth; C. Pampfer; J. Arps; C. Phiesel; C. Piel; R. Lebert
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Mask process correction for optical weak pattern improvement
Author(s): Pai Chi Chen; Chain Ting Huang; Shang Feng Weng; Yung Feng Cheng; Kazunori Nagai; Kenji Kono
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The impact of the reticle and wafer alignment mark placement accuracy on the intra-field mask-to-mask overlay
Author(s): Richard van Haren; Steffen Steinert; Orion Mouraille; Koen D’havé; Leon van Dijk; Jan Hermans; Dirk Beyer
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