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PROCEEDINGS VOLUME 10959 • new

Metrology, Inspection, and Process Control for Microlithography XXXIII
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Volume Details

Volume Number: 10959
Date Published: 17 June 2019

Table of Contents
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Front Matter: Volume 10959
Author(s): Proceedings of SPIE
Tough road ahead for device overlay and edge placement error
Author(s): Kaustuve Bhattacharyya
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Silicon-based quantum computing: manufacturing and metrology challenges (Conference Presentation)
Author(s): Richard M. Silver
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On device EPE: minimizing overlay, pattern placement, and pitch-walk, in presence of EUV stochastics and etch variations (Conference Presentation)
Author(s): Ofer Adan; Kevin Houchens
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Overlay error investigation for metal containing resist (MCR)
Author(s): Roel Gronheid; Satomi Higashibata; Onur Demirer; Yusuke Tanaka; Dieter Van den Heuvel; Ming Mao; Masaru Suzuki; Satoshi Nagai; Waikin Li; Philippe Leray
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Process drift compensation by tunable wavelength homing in scatterometry-based overlay
Author(s): Kun Gao; Pedro Herrera; Vidya Ramanathan; Victoria Naipak; Meng Wang; Renan Milo; Tal Yaziv; Nir BenDavid; Chen Dror; Hao Mei; Weihua Li; Xindong Gao; Linfei Gao; Md. Motasim Bellah; Karsten Gutjahr; Dongyue Yang; Cheuk Wun Wong; Xueli Hao; Tony Joung; DeNeil Park; Yue Zhou; Abhishek Gottipati
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Measuring after etch overlay and characterizing tilt fingerprints in multi-tier 3D-NAND structures
Author(s): Hong-Goo Lee; Dong-Young Lee; Jun-Yeob Kim; Sang-Jun Han; Chan-Ha Park; Jaap Karssenberg; Mir Shahrjerdy; Arno van Leest; Nang-Lyeom Oh; Dong-Hak Lee; Aileen Soco; Tjitte Nooitgedagt
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Standalone alignment technology enabling feed-forward compensation of on-product overlay errors
Author(s): Takehisa Yahiro; Junpei Sawamura; Sonyong Song; Sayuri Tanaka; Yuji Shiba; Satoshi Ando; Hiroyuki Nagayoshi; Jun Ishikawa; Masahiro Morita; Yuichi Shibazaki
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Machine learning and hybrid metrology using scatterometry and LE-XRF to detect voids in copper lines
Author(s): Dexin Kong; Koichi Motoyama; Abraham Arceo de la peña; Huai Huang; Brock Mendoza; Mary Breton; Gangadhara Raja Muthinti; Hosadurga Shobha; Liying Jiang; Juntao Li; James J. Demarest; John Gaudiello; Gauri Karve; Aron Cepler; Matthew Sendelbach; Susan Emans; Paul Isbester; Kavita Shah; Shay Wolfing; Avron Ger
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Image quality enhancement of a CD-SEM image using conditional generative adversarial networks
Author(s): Yoshihiro Midoh; Koji Nakamae
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Statistical significance of STEM based metrology on advanced 3D transistor structures
Author(s): Laurens Kwakman; Anne Kenslea; Hayley Johanesen; Jillian Cramer; Michael Strauss; Werner Boullart; Hans Mertens; Yong Kong Siew; Kathy Barla
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Edge placement error measurement in lithography process with die to database algorithm
Author(s): Yoshishige Sato; Shang-Chieh Huang; Kotaro Maruyama; Yuichiro Yamazaki
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Machine learning for predictive electrical performance using OCD
Author(s): Sayantan Das; Joey Hung; Sandip Halder; Guillaume Schelcher; Roy Koret; Igor Turovets; Mohamed Saib; Anne-Laure Charley; Matthew Sendelbach; Avron Ger; Philippe Leray
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E-beam inspection of single exposure EUV direct print of M2 layer of N10 node test vehicle
Author(s): Sayantan Das; Ryo Shimoda; Shinji Mizutani; Sandip Halder; Kotaro Maruyama; Philippe Leray; Yuichiro Yamazaki
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Gas-enhanced PFIB surface preparation enabled metrology and statistical analysis of 3D NAND devices
Author(s): Micah Ledoux; James Clarke; Brett Avedisian; Chad Rue; Umesh Adiga; Mark Biedrzycki
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Development of standard samples with programmed defects for evaluation of pattern inspection tools
Author(s): Susumu Iida; Takamitsu Nagai; Takayuki Uchiyama
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Latent imaging of resists via resonant x-ray scattering: unraveling the effects of chain scission to chemical amplification (Conference Presentation)
Author(s): Isvar Cordova; Guillaume Freychet; Scott D. Dhuey; Alexander Hexemer; Patrick P. Naulleau; Cheng Wang
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Improved sub-surface AFM using photothermal actuation
Author(s): Maarten E. v. Reijzen ; Mehmet S. Tamer; Maarten H. v. Es; Martijn v. Riel ; Aliasghar Keyvani; Hamed Sadeghian; Marco v. d. Lans
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Quantitative tomography with subsurface scanning ultrasound resonance force microscopy
Author(s): Maarten H. van Es; Laurent Fillinger; Hamed Sadeghian
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Full structure transistor process monitoring of boron and germanium in PFET EPI using in-line XPS
Author(s): Jusang Lee; Ganesh Subramanian; Manasa Medikonda; Hossam Lazkani; Judson Holt; Churamani Gaire; Paul Isbester; Mark Klare
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Nano-scale molecular analysis of photo-resist films with massive cluster secondary ion mass spectrometry
Author(s): Michael J. Eller; Mingqi Li; Xisen Hou; Stanislav V. Verkhoturov; Emile A. Schweikert; Peter Trefonas
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Unbiased roughness measurements: subtracting out SEM effects, part 3
Author(s): Chris A. Mack; Frieda Van Roey ; Gian F. Lorusso
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Linewidth and roughness measurement of SAOP by using FIB and Planer-TEM as reference metrology
Author(s): Kiyoshi Takamasu; Satoru Takahashi; Hiroki Kawada; Masami Ikota; Stefan Decoster; Frederic Lazzarino; Gian Lorusso
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Using critical-dimension grazing-incidence small angle x-ray scattering to study line edge roughness (Conference Presentation)
Author(s): Guillaume Freychet; Dinesh Kumar; Ron J. Pandolfi; Isvar A. Cordova; Patrick Naulleau; Alexander Hexemer; Gian Lorusso
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LER and LWR measurements used for monitoring wiggling and stochastic-failure (Conference Presentation)
Author(s): Hiroki Kawada; Yasushi Ebizuka; Takumichi Sutani; Takahiro Kawasaki
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Roughness decomposition: an on-wafer methodology to discriminate mask, metrology, and shot noise contributions
Author(s): Gian Francesco Lorusso; Gijsbert Rispens; Vito Rutigliani; Frieda Van Roey; Andreas Frommhold; Guido Schiffelers
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Application of PSD for the extraction of programmed line roughness from SAXS
Author(s): Jérôme Reche; Maxime Besacier; Patrice Gergaud; Yoann Blancquaert
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Surface effects in simulations of scanning electron microscopy images
Author(s): L. van Kessel; C. W. Hagen; P. Kruit
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Optical characterization of multi-NST nanowire test structures using Mueller matrix spectroscopic ellipsometry (MMSE) based scatterometry for sub 5nm nodes
Author(s): Madhulika Korde; Subhadeep Kal; Cheryl Pereira; Nick Keller; Aelan Mosden; Alain C. Diebold
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Tilted beam SEM, 3D metrology for industry
Author(s): Charles Valade; Jérôme Hazart; Sébastien Bérard-Bergery; Elodie Sungauer; Maxime Besacier; Cécile Gourgon
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Applications of machine learning at the limits of form-dependent scattering for defect metrology
Author(s): Mark-Alexander Henn; Hui Zhou; Richard M. Silver; Bryan M. Barnes
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Engineering neural networks for improved defect detection and classification
Author(s): Dhruv Patel; Ravi Bonam; Assad A. Oberai
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Using Gaussian process regression for efficient parameter reconstruction
Author(s): Philipp-Immanuel Schneider; Martin Hammerschmidt; Lin Zschiedrich; Sven Burger
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Deep learning's impact on contour extraction for design based metrology and design based inspection
Author(s): Ryo Yumiba; Masayoshi Ishikawa; Shinichi Shinoda; Shigetoshi Sakimura; Yasutaka Toyoda; Hiroyuki Shindo; Masayuki Izawa
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OPC model accuracy study using high volume contour based gauges and deep learning on memory device
Author(s): Young-Seok Kim; SeIl Lee; Zhenyu Hou; Yiqiong Zhao; Meng Liu; Yunan Zheng; Qian Zhao; Daekwon Kang; Lei Wang; Mark Simmons; Mu Feng; Jun Lang; Byoung-Il Choi; Gilbert Kim; Hakyong Sim; Jongcheon Park; Gyun Yoo; JeonKyu Lee; Sung-woo Ko; Jaeseung Choi; Cheolkyun Kim; Chanha Park
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What is prevalent CD-SEM's role in EUV era?
Author(s): Zhigang Wang; Yoshinori Momonoi; Katsumi Setoguchi; Makoto Suzuki; Satoru Yamaguchi
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High voltage CD-SEM based metrology for 3D-profile measurement using depth-correlated BSE signal
Author(s): Wei Sun; Yasunari Sohda; Hiroya Ohta; Taku Ninomiya; Yasunori Goto
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Deep-learning-based SEM image denoiser (Conference Presentation)
Author(s): Dorin Cerbu; Sandip Halder; Philippe Leray
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FEM simulation for artificial generation of SEM pictures
Author(s): Duy Duc Nguyen; Jean-Herve Tortai; Patrick Schiavone
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3D-SEM challenges: How can we profile in-die 3D geometry of the integrated circuits? (Conference Presentation)
Author(s): Makoto Suzuki; Ayumi Doi
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Investigating process variability at ppm level using advanced massive eBeam CD metrology and contour analysis
Author(s): B. Le-Gratiet; O. Mermet; C. Gardin; S. Desmoulins; T. Kiers; Y. Wang; P. Tang; D. Tien; F. Wang; C. Prentice; W. Tel; S. Hunsche
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Depth measurement technique for extremely deep holes using back-scattered electron images with high voltage CD-SEM
Author(s): Takahiro Nishihata; Mayuka Osaki; Maki Tanaka; Takuma Yamamoto; Akira Hamaguchi; Chihiro Ida; Yusaku Suzuki
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Evaluation of the accuracy and precision of STEM and EDS metrology on horizontal GAA nanowire devices
Author(s): Hayley Johanesen; Michael Strauss; Anne Kenslea; Chris Hakala; Laurens Kwakman; Werner Boullart; Hans Mertens; Yong Kong Siew; Kathy Barla
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High-resolution low-shrinkage CD metrology for EUV resist using high voltage CD-SEM
Author(s): Daisuke Bizen; Shunsuke Mizutani; Makoto Sakakibara; Makoto Suzuki; Yoshinori Momonoi
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Improved accuracy and robustness for advanced DRAM with tunable multi-wavelength imaging and scatterometry overlay metrology
Author(s): Honggoo Lee; Sangjun Han; Minhyung Hong; Jieun Lee; Dongyoung Lee; Ahlin Choi; Chanha Park; Dohwa Lee; Seongjae Lee; Jungtae Lee; Jeongpyo Lee; DongSub Choi; Sanghuck Jeon; Zephyr Liu; Hao Mei; Tal Marciano; Eitan Hajaj; Lilach Saltoun; Dana Klein; Eran Amit; Anna Golotsvan; Wayne Zhou; Eitan Herzel; Roie Volkovich; John C. Robinson
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Edge placement error and line edge roughness
Author(s): Vassilios Constantoudis; George Papavieros; Evangelos Gogolides
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Color mixing in overlay metrology for greater accuracy and robustness
Author(s): Simon Mathijssen; Marc Noot; Murat Bozkurt; Narjes Javaheri; Reza Hajiahmadi; Antonios Zagaris; Ken Chang; Benny Gosali; Eason Su; Cathy Wang; Arie den Boef; Kaustuve Bhattacharyya; Guo-Tsai Huang; Kai-Hsiung Chen; John Lin
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Smart implant-layer overlay metrology to enable fab cycle time reduction
Author(s): Leon van Dijk; Faegheh Hasibi; Maialen Larrañaga; Anne Pastol; Auguste Lam; Richard van Haren
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Intra-field stress impact on global wafer deformation
Author(s): Richard van Haren; Ronald Otten; Subodh Singh; Amandev Singh; Leon van Dijk; David Owen; Doug Anberg; Jeffrey Mileham; Yajun Gu; Jan Hermans
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AI: from deep learning to in-memory computing
Author(s): Hsiang-Lan Lung
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Massive metrology and failure identification for DRAM applications (Conference Presentation)
Author(s): Harm Dillen; Dorothe Oorschot; Marleen Kooiman; Willem van Mierlo; Ziyang Wang; Kang-San Lee; Jin-Woo Lee; Ruochong Fei; Shu-Yu Lai; Marc Kea; Inhwan Lee; Hwan Kim; Junghyun Kang; Jaehee Hwang; Chang-Moon Lim
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3D optical proximity model optimization using inline 3DSEM metrology
Author(s): Shimon Levi; Ishai Schwarzband; Angela Karvtsov; Matan Tobayas; Hans-Jurgen Stock; Thomas Muelders; Sean Hand; Jason Osborne
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Contour based metrology: getting more from a SEM image
Author(s): B. Le Gratiet; Regis Bouyssou; J. Ducoté; Christophe Dezauzier; Alain Ostrovsky; Charlotte Beylier; Christian Gardin; Paolo Petroni; Matthieu Milléquant; Alexandre Chagoya-Garzon; Patrick Schiavone
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Scatterometry and AFM measurement combination for area selective deposition process characterization
Author(s): Mohamed Saib; Alain Moussa; Anne-Laure Charley; Philippe Leray; Joey Hung; Roy Koret; Igor Turovets; Avron Ger; Shaoren Deng; Andrea Illiberi; Jan Willem Maes; Gabriel Woodworth; Michael Strauss
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Localized power spectral density analysis on atomic force microscopy images for advanced patterning applications
Author(s): Alain Moussa; Mohamed Saib; Sara Paolillo; Frederic Lazzarino; Andrea Illiberi; Shaoren Deng; Jan Willem Maes; Anne-Laure Charley; Philippe Leray
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Focus budget improvement using optimized wafer edge settings
Author(s): Lucas Lamonds; Bryan Orf; Michael Frachel; Xaver Thrun; Georg Erley; Philip Groeger; Boris Habets; Alexander Muehle
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New approach for APC and measurement sampler interaction in a complex process mix logic fab
Author(s): L. Lecarpentier; A. Mili; J. Decaunes; B. Le Gratiet
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Multiple beam inspection (MBI) for 7nm node and beyond: technologies and applications
Author(s): Eric Ma; Kevin Chou; Martin Ebert; Xuedong Liu; Weiming Ren; Xuerang Hu; Martijn Maassen; Weihua Yin; Aiden Chen; Fei Wang; Oliver D. Patterson
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SEM inspection and review method for addressing EUV stochastic defects
Author(s): Tal Itzkovich; Aner Avakrat; Shimon Levi; Omri Baum; Noam Amit; Kevin Houchens
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Voltage contrast edge placement estimation for overlay, CD, and local uniformity metrology (Conference Presentation)
Author(s): Cyrus E. Tabery; Vito Rutigliani; Simon Hastings; Etienne de Poortere; Luke Wang; Philippe Leray; Guillaume Schelcher; Yongjun Wang
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Process window discovery methodology for extreme ultraviolet (EUV) lithography
Author(s): Sandip Halder; Dieter Van den Heuvel; Stephane Lariviere; Philippe Leray; Kaushik Sah; Andrew Cross; Antonio Mani
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Spectroscopic reflectometry in the extreme ultraviolet for critical dimension metrology
Author(s): Lukas Bahrenberg; Serhiy Danylyuk; Robert Michels; Sven Glabisch; Moein Ghafoori; Sascha Brose; Jochen Stollenwerk; Peter Loosen
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Visualization of 3D structure of semiconductor devices by "Dig and See" using GFIS-SIM
Author(s): Shinichi Matsubara; Hiroyasu Shichi; Sayaka Tanimoto; Masami Ikota; Tomihiro Hashizume
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Influence of sidewall perturbations of CD-SEM line roughness metrology
Author(s): Benjamin D. Bunday; Chris A. Mack; Sergei Borisov; Vera Sinitsina
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Deep learning nanometrology of line edge roughness
Author(s): Eva Giannatou; Vassilios Constantoudis; George Papavieros; Harria Papagrorgiou; Gian Francesco Lorusso; Vito Rutigliani; Frieda van Roey; Evangelos Gogolides
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Novel method to achieve CD modeling in the presence of higher diffraction orders
Author(s): Phillip R. Atkins; Liequan Lee; Shankar Krishnan; Chi-Fu Yen; Shyh-Shii Pai; Nick Weihan Chang; Hsien-Hung Chang; Li-Shiuan Tsai; Sheng-Yang Tseng; Jan-Hau Chang; Yung-Hsiang Lin; Chu-Han Chiu; Chun-Sheng Wu
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Application of aberration corrected low voltage SEM for metrology
Author(s): Zh. H. Cheng; H. Dohi; S. Hayashi; K. Hirose; H. Kazumi
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An optimized parameter guidance system for line/space CD metrology
Author(s): Nan Zhao; Lingling Pu; Teng Wang; Wentian Zhou; Ming Xu; Wei Fang; Brian Lee
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Metrology of 3D NAND in electron micrographs by scale space snakes
Author(s): Umesh Adiga; Michael Strauss; Ashley Tilson; Jason Arjavac; Jack Hagger; Dan Nelson; Justin Roller
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Measurement system of film structure by interferometry and ellipsometry
Author(s): K.-N. Joo; Y. H. Yun
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Process monitoring and control with tunable wavelength overlay coupled with simulation-to-measurement analysis
Author(s): Pedro Herrera; Kun Gao; Chen Dror; Eitan Hajaj; Alon Alexander Volfman; Raviv Yohanan; Vidya Ramanathan; Victoria Naipak; Renan Milo; Tal Yaziv; Nir BenDavid; Meng Wang; Hao Mei; Weihua Li; Xindong Gao; Dongyue Yang; Cheuk Wun Wong; Karsten Gutjahr; Xueli Hao; Tony Joung; Md. Motasim Bellah; DeNeil Park; Yue Zhou; Abhishek Gottipati
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Parallel active cantilever AFM tool for high-throughput inspection and metrology
Author(s): Mathias Holz; Christoph Reuter; Ahmad Ahmad; Alexander Reum; Tzvetan Ivanov; Elshad Guliyev; Ivo W. Rangelow; Ho-Se Lee
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Detection of particle defect components on silicon wafer with laser induced breakdown spectroscopy combined laser cleaning technology
Author(s): Lituo Liu; Xiaoya Yu; Weihu Zhou; Xiaomei Chen; Rongyi Ji; Guannan Li
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Accurate vertical sidewall measurement by a metrological tilting-AFM for reference metrology of line edge roughness
Author(s): Ryosuke Kizu; Ichiko Misumi; Akiko Hirai; Satoshi Gonda
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Casual modeling of yield
Author(s): Jeffrey Weintraub; Scott Warrick
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First results from the Large Dynamic Range Atomic Force Microscope for overlay metrology
Author(s): G. Witvoet; J. Peters; S. Kuiper; S. Keyvani; R. Willekers
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CD and OCD sampling scheme optimization for HVM environment
Author(s): Chanha Park; Hongoo Lee; Dongyoung Lee; Ahlin Choi; Stefan Buhl; Wan-Soo Kim; Philip Groeger; Steffen Guhlemann; Seop Kim; Mingyu Kim
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Deep learning's impact on pattern matching for design based metrology and design based inspection
Author(s): Shuyang Dou; Shinichi Shinoda; Masayoshi Ishikawa; Ryo Yumiba; Yasutaka Toyoda; Hiroyuki Shindo; Masayuki Izawa; Masanori Ouchi
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Study on a feasibility of dark-field illumination for the near-field microscope
Author(s): Hangyeong Oh; Woojun Han; Yungi Lee; Jaisoon Kim
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Enhanced wafer overlay residuals control; deep sub-nanometer at sub-millimeter lateral resolution
Author(s): Avi Cohen; Philippe Leray; Eren Canga; Vladimir Dmitriev; Kujan Gorhad; Yael Sufrin
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Area-framing optical defect review under optical resolution using multi-NA dark-field microscopy images
Author(s): Jun Ho Lee; Junhee Jeong; Chris Park; Shin-Woong Park; Hwi Kim; Byeong Geon You
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YieldStar uDBO overlay metrology in Samsung D1y DRAM volume production
Author(s): Jang-Sun Kim; Jin-Moo Byun; Remco Lancee; Jong-Hyun Hwang; Hyeon-Jun Ha; Kwang-Young Hu; Se-Ra Jeon; Won-Jae Jang; Hyung-Sub Son; Vidar van der Meijden; Marc Noot; Bartosz Foltynski; Lukasz Macht; Grzegorz Grzela; Cedric Grouwstra
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New method removing SEM image noise to characterize CD and LWR
Author(s): Shinji Kobayashi; Satoru Shimura; Masashi Enomoto; Robert Kern; Timothy Diller; Tony McDaniel; Nan Qin; Thomas Reay; Roger Serwy
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Alignment sampling by thorough run-to-run simulation
Author(s): Alex Ren; Ding Kai; Boris Habets; Steffen Guhlemann; Norman Birnstein; Alexander Mühle; Patrick Lomtscher; Rex Liu
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Overlay run-to-run control based on device structure measured overlay in DRAM HVM
Author(s): Hsiao Lun Chu; Foster Huang; Steven Tottewitz; Boris Habets; Patrick Lomtscher; Hsiao-Lin Hsu; Afu Chiu; Rex H. Liu
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Analysis and modelling of patterned wafer nano-topography using multiple linear regression on design GDS and silicon PWG data
Author(s): M. Kessar; B. Le-Gratiet; P. Lemaire; V. Brouzet; D. Le Cunff; V. Gredy
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Macro CDSEM 2D metrology supporting advanced DRAM patterning
Author(s): R. Kris; G. Klebanov; I. Schwarzband; E. Sommer; L. Gershtein; B. Mathew; E. Noifeld; S. Levy; R. Alkoken; O. Novak; H. Miroku; D. Rathore ; S. Pastur; S. Duvdevani-Bar; T. Bar-On; I. Horikawa
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Intra-field alignment for overlay feed-forward simulation with sampling optimization
Author(s): Cheng Hao Yang; Chun Chi Yu; Patrick Lomtscher; Martin Freitag; Steven Tottewitz; Boris Habets; Hsiao Lin Hsu; Rex H. Liu
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In-depth analysis and research of additional components of the uncertainty budget using the finite element method
Author(s): Vladimir Skliarov
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Characterization of STEM alignments and their automation
Author(s): Ashley Tilson; Silvia Aerts
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Analyze line roughness sources using power spectral density (PSD)
Author(s): Lingling Pu; Teng Wang; Thomas J. Huisman; Ruben Maas; Maikel Goosen; Harm Dillen; Philippe Leray; Wei Fang
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A diffraction-based overlay model based on FDTD method
Author(s): Buqing Xu; Ling Ma; Xiongfeng Zou; Lisong Dong; Yayi Wei
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Verification and analysis of FEM for measurement of temperature distribution through the multilayer wall
Author(s): Vladimir Skliarov; Pavel Neyezhmakov; Alexander Prokopov
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Denoising line edge roughness measurement using hidden Markov models
Author(s): George Papavieros; Ioannis Kontoyiannis; Vassilios Constantoudis; Evangelos Gogolides
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Defect learning with predictive sampling for process improvement
Author(s): Ian Tolle; Julie Lee; Dave Salvador; Barry Saville; Poh-Boon Yong; Gino Marcuccilli
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First demonstration of a 331-beam SEM
Author(s): C. Riedesel; I. Müller; N. Kaufmann; A. Adolf; N. Kämmer; H. Fritz; A. L. Eberle; D. Zeidler
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Machine learning for predictive electrical performance using OCD (Erratum)
Author(s): Sayantan Das; Joey Hung; Sandip Halder; Guillaume Schelcher; Roy Koret; Igor Turovets; Mohamed Saib; Anne-Laure Charley; Matthew J. Sendelbach; Avron Ger; Philippe Leray
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