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PROCEEDINGS VOLUME 1087

Integrated Circuit Metrology, Inspection, and Process Control III
Editor(s): Kevin M. Monahan
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Volume Details

Volume Number: 1087
Date Published: 19 July 1989
Softcover: 55 papers (545) pages
ISBN: 9780819401229

Table of Contents
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Electron Beam Metrology For Integrated Circuit Structures: Predictions And Experiments
Author(s): Sylvester Johnson; Jo A. McMillan; Noel C. MacDonald
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A Study of Electron Damage Effects During Low Voltage SEM Metrology
Author(s): Pradeep K. Bhattacharya; Susan K. Jones; Arnold Reisman
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Techniques For High Speed SEM Wafer Inspection For Production Applications
Author(s): Guillermo L. Toro-Lira
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Electron Beam Generation Based On Negative Electron Affinity Photocathodes
Author(s): Colin A. Sanford; Noel C. MacDonald
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Metrological Electron Microscope for the Certification of Magnification and Linewidth Artifacts for the Semiconductor Industry
Author(s): Michael T. Postek; William J. Keery; Samuel Jones
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Scanning Electron Microscope Magnification Calibration for Metrology Applications
Author(s): Murray Reeves; Glen Herriot
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Accuracy of Spatial Metrology
Author(s): Karl Harris; Israel Nadler-Niv; Dorron Levy
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Contact Window Metrology Using The Photocleave Technique
Author(s): T. Yang; D. E. Schrope; B. J. Dardzinski; J. D. Cuthbert
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Proximity- and Astigmatism-Tolerant Testsites For Electrical Linewidth Measurement
Author(s): B. J. Lin
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Electrical Defect Monitoring For Process Control
Author(s): Charles F. King; G. Peter Gill; Michael J. Satterfield
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An Analysis Of Electron Beam Registration Capabilities By Electrical Measurement Methods
Author(s): James P. Rominger
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Application of submicron Linewidth Measuring Technique To Photomasks
Author(s): Nelda D. Clelland; Geoff S. Glaspie
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Effect Of Resist Side-Wall Slope Variations On Confocal Optical Metrology
Author(s): J. McCall; R. DeRosa; E. A. Peltzer; I. R. Smith; R. Nielson
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The Application Of Coherence Probe Microscopy For Submicron Critical Dimension Linewidth Measurement
Author(s): J. William Dockrey; Douglas Hendricks
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Characterization of a Real-time Confocal Scanning Optical Microscope
Author(s): T. R. Corle; G. Q. Xiao; G. S. Kino; N. S. Levine
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Linewidth Edge Detection Algorithm for Coherent Image Profiles
Author(s): Diana Nyyssonen; Bob Monteverde
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Statistical Correlation Between Optical Linewidth Measurement Systems With Variance Components Analysis
Author(s): Eileen Jozefov; Paul Mullenix; Wayne Ruch
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Automated Calibration Of Optical Photomask Linewidth Standards At The National Institute Of Standards And Technology
Author(s): James Potzick
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Characterization of Automated Wafer Inspection Tools
Author(s): Rick Wallace; Gary Dickerson
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Combining Electrical Defect Monitors with Automatic Visual Inspection Systems
Author(s): Christopher W. Teutsch; David C. Drain
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The P300: An Approach to Automated Inspection of Patterned Wafers
Author(s): Virginia Brecher; Raymond Bonner; Byron E. Dom
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Defect Partitioning: A New Methodology
Author(s): Susan P. Billat; Prasanna Chitturi
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Matching Management Of Multiple Wafer Steppers Using A Stable Standard And A Matching Simulator
Author(s): M. A. van den Brink; C. G. M. de Mol; H. F. D. Linders; S. Wittekoek
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Lens Matching And Distortion Testing In A Multi-Stepper, Sub-Micron Environment
Author(s): Alan Yost; Wei Wu; Terrence Zavecz; Faris Modawar
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Data Regression Procedure For Comparative Evaluation Of Photolithography Systems
Author(s): Robert L. Brown; Alan Levine
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A Computer Aided Engineering Workstation For Registration Control
Author(s): Edward A. Mc Fadden; Christopher P. Ausschnitt
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Advanced Manufacturing Techniques As Applied To ASIC Photolithographic Processing
Author(s): Daniel C. Carter; Brian P. Bystedt
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A Systematic Approach for I-line Manufacturing Process Optimization
Author(s): Khoi Phan; Michael Templeton; Edwin Sum
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Process Sensitivity Analysis: Application to Photolithography
Author(s): Philippe Schoenborn; Nicholas F. Pasch
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Resist Profile Control Obtained Through A Desirability Function And Statistically Designed Experiments
Author(s): K. L. Bell; L. D. H. Christensen
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Development Process Control And Optimization Utilizing An End Point Monitor
Author(s): Kenneth M. Sautter; Marie Ha; Tom Batchelder
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Endpoint Detection Of Photoresist Development Using Multiple Wavelengths And Polarized Light
Author(s): Kevin M. Monahan
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A Model for End Point Detect During the Development of Photoresists
Author(s): Michael P. C. Watts; Stephen Williams; Patrick McCarthy; Michael Tsai; David Eimerl
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Scanning Photon And Scanning Electron Metrology On Photomasks
Author(s): Robert H. J. Fastenau; Kevin M. Monahan; Barry J. Jennings; Martin J. Verheijen
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Sub 0.5 Micron Optical Metrology
Author(s): Brian Chisholm; Don Yansen; Christopher Morrill
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Optical Phase-Shifting Technique For Submicron Linewidth Measurement: Simulations And Measurements
Author(s): Yiping Xu; Evelyn Hu; Susan Hackwood; Glen Wade
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Optical Overlay Versus Electric Probe Measurement
Author(s): Keith Y. Mortensen; Betty Ann Blachowicz
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A Statistical Approach To Automated Overlay Measurement Precision, Repeatability, And Reproducibility
Author(s): Richard F. Babasick; Irwin Grater
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Statistically Comparing Three Optical Cd Measurement Systems
Author(s): David A. Acree; Chen Lee
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Investigation Of Linewidth Uniformity In X-Ray Lithography
Author(s): U. Mescheder; U. Mackens; F. Mund
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Applications of STM Technologies
Author(s): Paul E. West; Sheila Henely
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Flatness Measurements Of Mounted Stage Mirrors
Author(s): Earl Ebert
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Displacement Interferometer with High Resolution and Low Sensitivity to Temperature
Author(s): Kenneth J. Wayne
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Optical Measurement Of Contacts
Author(s): Peter Waksman
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Recent Advances In Automated Patterned Wafer Inspection
Author(s): Rod Browning; Ian Lincoln; Peter Stonestrom
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Optical Thick And Thin Film Metrology On Various Substrates Using A High Resolution Reflection Spectrophotometer
Author(s): R. Eandi; W. Hunn; M. Eckhardt; H. Engel; H. Becker
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An In Situ Interferometric Analysis Of Resist Development On Photomask Substrates
Author(s): A. E. Novembre; W. T. Tang; P. Hsieh
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Nonparametric Approximation Methods-A New Tool For Process Engineering
Author(s): David E. A. Smith; Robert L. Kostelak
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Synergistic Effects Of Softbake And Hardbake On Thermal Softening Using Statistically Designed Experiments
Author(s): K. L. Bell; E. M. Holicky; L. D. H. Christensen
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Method For Accurately Forecasting The Effects Of The "Post Exposure Bake"
Author(s): Yuichiro Yanagishita; Kazumasa Shigematsu; Kimio Yanagida
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Resist On Quartz Inspection In A Manufacturing Environment
Author(s): Gernia Tang; Gabe Kim; Gary V. VanNice
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Methodology For Reduction Of Sampling On The Visual Inspection Of Developed And Etched Wafers
Author(s): Jamie S. VanDeVen; Fred Khorasani
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New Logic State Measurement Technique For The Electron Beam Tester
Author(s): A. Ito; K. Ookubo; T. Ishizuka; A. Muto; Y. Goto
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A Machine Vision Architecture For Integrated Circuit Inspection
Author(s): Sal D' Agostino
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Wafer Inspection Technology For Submicron Devices
Author(s): Kazunori Okamoto; Shokichi Yoshitome
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