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PROCEEDINGS VOLUME 1086

Advances in Resist Technology and Processing VI
Editor(s): Elsa Reichmanis
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Volume Details

Volume Number: 1086
Date Published: 22 August 1989
Softcover: 60 papers (629) pages
ISBN: 9780819401212

Table of Contents
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Chemically Amplified Resists: A Lithographic Comparison of Acid Generating Species.
Author(s): T. X. Neenan; F. M. Houlihan; E. Reichmanis; J. M. Kometani; B. J. Bachman; L. F. Thompson
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Sensitive Electron Beam Resist Systems Based On Acid-Catalyzed Deprotection
Author(s): Hiroshi Ito; Lester A. Pederson; Kaolin N. Chiong; Susan Sonchik; Cecilia Tsai
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A New Positive Resist for KrF Excimer Laser Lithography
Author(s): Yoshiyuki Tani; Masayuki Endo; Masaru Sasago; Kazufumi Ogawa
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Deep UV ANR Photoresists For 248 nm Excimer Laser Photolithography
Author(s): James W. Thackeray; George W. Orsula; Edward K. Pavelchek; Dianne Canistro; Leonard E. Bogan; Amanda K. Berry; Karen A. Graziano
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Mechanisms Of The Dissolution Inhibition Effect And Their Application To Designing Novel Deep-UV Resists
Author(s): Makoto Murata; Mitsunobu Koshiba; Yoshiyuki Harita
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A Chemical Reaction And Influence Of Deep-UV Light Wavelength On REL (Resolution Enhanced Lithography)
Author(s): H. Fukumoto; Y. Okuda; Y. Takashima; T. Ohkuma; S. Ueda; M. Inoue
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Radiation Effects Of Various Ion Beams On Resists Studied By Product Analysis And New Nanosecond Ion Beam Pulse Radiolysis
Author(s): Seiichi Tagawa; Noriyuki Kouchi; Hiromi Shibata; Yoneho Tabata
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On The Molecular Mechanism Of Positive Novolac Resists
Author(s): Jian-Ping Huang; T. K. Kwei; Arnost Reiser
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Novolak Based Thermally Resistant Positive Photoresist: Resin Design and Performance
Author(s): A. Zampini; R. L. Fischer; J. B. Wickman
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Improved Thermal Stability Of High Resolution Positive Photoresists Via Elevated Softbake Temperatures
Author(s): Marc T. Aronhime; Chava Gal; Shoshana Silady; John J. Grunwald; Donald W. Johnson; Theodore A. Martin; Allen C. Spencer; David A. Sawoska
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Dissolution Rate Modifying Chemistry: Interaction of Base-soluble and Base-insoluble Non-actinic Dyes With Novolak Polymers and Novolak-based Positive Photoresists
Author(s): George J. Cernigliaro; Michael F. Cronin; Thomas A. Fisher; Marjorie E. Perkins; Pamela Turci
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Image Reversal Resist for g-line Exposure: Chemistry and Lithographic Evaluation
Author(s): Gerhard Buhr; Helmut Lenz; Siegfried Scheler
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The Effect Of Sensitizer Chemistry On Decarboxylation-Type Image Reversal Systems
Author(s): John J. Grunwald; Chava Gal; Marc T. Aronhime; Sigalit Eidelman; Donald W. Johnson; Eitan Shalom
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Simulation of Etching Profiles and Process Latitudes for the O2 Reactive Ion Etching Pattern Transfer Step in Multilevel Lithography
Author(s): Charles W. Jurgensen; Eric S. G. Shagfeh
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Silicon Oxidation During Bilayer Resist Etching
Author(s): Mark A. Hartney; Justin N. Chiang; David S. Soane; Dennis W. Hess; Robert D. Allen
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Polysiloxanes with a Phenol Moiety for Bilayer Photoresist Applications
Author(s): Yasunobu Onishi; Touru Ushirogouchi; Rumiko Horiguchi; Shuzi Hayase
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Sub-half-micron Patterning Characteristics of Silicone-based Positive (SPP) and Negative (SNP) Resists in KrF Excimer Laser Lithography
Author(s): Yoshio Kawai; Akinobu Tanaka; Yoshiharu Ozaki; Kiichi Takamoto; Akira Yoshikawa
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Excimer Laser Exposure Characteristics Of Inorganic Resists Based On Peroxo-Polytungstic Acids
Author(s): Akira Ishikawa; Hiroshi Okamoto; Katsuki Miyauchi; Tetsuichi Kudo
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A Novel Photooxidative Scheme for Imaging at Polymer Surfaces
Author(s): Omkaram Nalamasu; Gary N. Taylor
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Dry Lithography with Deep-UV Exposure Using Silylated Resist Materials
Author(s): Chris Spence; Yosi Shacham-Diamand
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Single Level Dry Developable Resist Systems, Based On Gas Phase Silylation
Author(s): Jack P. W. Schellekens; Robert-Jan Visser
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Evaporated Fatty Acid Resist Process
Author(s): Hisato Kato; Shinzo Morita; Masahiro Tawata; Shuzo Hattori
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High Contrast Single Layer Resists And Antireflection Layers - An Alternative To Multilayer Resist Techniques
Author(s): C. Nolscher; L. Mader; M. Schneegans
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Polymer Chain Configurations In Constrained Geometries: Ultrathin Polymer Films For Microlithography
Author(s): S. W. J. Kuan; P. S. Martin; C. W. Frank; R. F. W. Pease
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Modeling and Simulation of Multiple Chemical States in Photoresist Materials
Author(s): Richard A. Ferguson; Chris A. Spence; Yosi Shacham-Diamand; Andrew R. Neureuther
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Picosecond Electron-Beam And Synchrotron Radiation Pulse Radiolysis For Studies On Electron-Beam And X-Ray Resists
Author(s): Yoichi Yoshida; Hiromi Shibata; Seiichi Tagawa; Masakazu Washio; Yoneho Tabata; Noriyuki Kouchi; Atsushi Ogata
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An Experimental Characterization System for Deep Ultra-Violet (UV) Photoresists
Author(s): Dean M. Drako; William N. Partlo; W. G. Oldham; A. R. Neureuther
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Advanced Bilayer Resist Process With Optimized PMGT Formulation
Author(s): W. Brunsvold; C. Lyons; W. Conley; D. Crockatt; M. Skinner; A. Uptmor
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New Pattern Transfer Technology For G-line Lithography
Author(s): M. Sasago; M. Endo; H. Nakagawa; K. Matsuoka; Y. Tani; Y. Hirai; N. Nomura
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Dry Developable Plasma Polymerized Photo-Resist System For Curved Surface Fabrication
Author(s): Hitomi Yamada; Makoto Nakamura; Shinzo Morita; Shuzo Hattori; Norio Ishikawa; Masao Miyazaki; Hayato Katsuragi; Kiyoto Mori
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Statistically Developed Single Layer Liftoff For Sputtered Films
Author(s): Ron Alderman; Pam Lou
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Fourier Transform Infrared Analysis of Resist Process and its Application.
Author(s): Chunshing Chen; Jen-Jiang Lee; Mike Blackwell; Chang-ou Lee; Wei Wu
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Surface Characterization Of Aluminum Substrates Exposed To Photoresist Developers
Author(s): K. A. Graziano; C. S. Allen; Hua-Yu Liu
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Ultrahigh Resolution Positive Working Photoresist For Half-Micron Photolithography
Author(s): Yoshiyuki Satoh; Hidekatsu Kohara; Nobuo Tokutake; Kohichi Takahashi; Toshimasa Nakayama
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Polyhydroxystyrene Carbonate Esters for High Sensitivity Photoresists Having Autodecomposition Temperatures > 160°
Author(s): W. Brunsvold; W. Conley; D. Crockatt; N. Iwamoto
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Photoactive Compound Structure And Resist Function: The Influence Of Chromophore Proximity
Author(s): Charles R. Szmanda; Anthony Zampini; David C. Madoux; Clayton L. McCants
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Novel Structures of Novolak Resins Designed to Improve Resist Alkaline Dissolution, Resolution, Thermal Resistance and Ease of Manufacturing
Author(s): Medhat A. Toukhy; Bernard T. Beauchemin
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X-ray Chemical Reactions of Novolac Diazonaphthoquinone Resists
Author(s): Derrick C. Mancini; Monroe Sullivan; James W. Taylor; Richard Bormett; T. V. Jayaraman; Richard J. West
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Positive-Working Polyimide Resists Based On Diazonaphthoquinone Photochemistry
Author(s): Mary G. Moss; Ruth M. Cuzmar; Terry Brewer
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Materials For Photochemical Image Enhancement With 436, 365, Or 248 nm Radiation
Author(s): James R. Sheats
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Reducing The Process "K" Factor With Surface Imaging Techniques
Author(s): Mike Tipton; Cesar Garza; Tom Seha
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Feasibility Study of Silylation Process for Submicron Manufacturing
Author(s): Michael Templeton; Khoi Phan; Edwin Sum
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0.6 µm CMOS Technology Using Desire Process
Author(s): F. Vinet; M. Chevallier; J. C. Guibert; Ch. Pierrat
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Use Of Plasmask Resist (Desire Process) On Metal II In IC Device Fabrication
Author(s): J. P. Chollet; F. Debaene
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A New Mid-UV Resist With Oxygen Plasma Resistance
Author(s): J. M. Liu; C. H. Tzeng
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Characterization Of Structure In Thin Polymer Resist Films
Author(s): L. L. Kosbar; S. W. J. Kuan; C. W. Frank; R. F. W. Pease
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Characteristics Of A Developer For Spray Puddle Develop Processes
Author(s): T. Perera
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Positive Photoresist Development: A Multiple State Percolation Model
Author(s): Peter Trefonas
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Three Dimensional Profile Simulation For Positive Photoresists
Author(s): E. Barouch; B. Bradie; S. V. Babu
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Characterization Of A UV Resist for 248 nm Lithography
Author(s): Yosi Y. Shacham-Diamand; William N. Partlo; William G. Oldham
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A Lithographic Study of Photoresists Containing a Base Soluble Dye
Author(s): M. Cagan; M. Blanco; V. Wise; P. Trefonas; B. K. Daniels; C. McCants
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Film Curvature Effects for Optical Resists Patterned on Topography
Author(s): L. K. White
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Improved Bake Latitude Organic Anti-Reflective Coatings for High Resolution Metallisation Lithography
Author(s): B. Martin; A. N. Odell; J. E. Lamb
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Submicron Metallization Utilizing a Versatile Trilayer Resist/Liftoff Process
Author(s): Susan K. Jones; Stephen M. Bobbio; Bruce W. Dudley; Edward K. Pavelchek
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Evaluating Process Optimums for Production VLSI Lithography
Author(s): Erik S. Brown; William C. Nelson; Gene Howland
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An I-Line Image Reversal Process For Submicron Lithography
Author(s): Ron Chu; Bhanwar Singh
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Advanced Image Reversal Techniques
Author(s): James W. Taylor; Thomas L. Brown; David R. Bassett
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Reduced Device Damage Using An Ozone Based Photoresist Removal Process
Author(s): Calvin Gabriel; James C. Mitchener
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Simulation Of Latent Image Manipulation A Versatile Simulation Program For New Photolithographic Systems
Author(s): R. J. Visser; H. P. Urbach; A. J. W. Tol; H. Eggink; E. G. H. M. Kemna
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