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PROCEEDINGS VOLUME 10809 • new

International Conference on Extreme Ultraviolet Lithography 2018
Editor(s): Kurt G. Ronse; Eric Hendrickx; Patrick P. Naulleau; Paolo A. Gargini; Toshiro Itani
Format Member Price Non-Member Price
Softcover $97.50 $130.00

Volume Details

Volume Number: 10809
Date Published: 23 November 2018
Softcover: 37 papers (346) pages
ISBN: 9781510622135

Table of Contents
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Front Matter: Volume 10809
Author(s): Proceedings of SPIE
Accelerate lithography improvement for high performance computing
Author(s): John Y. Chen
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Current challenges and opportunities for EUV lithography
Author(s): Harry J. Levinson; Timothy A. Brunner
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EUV industrialization high volume manufacturing with NXE3400B
Author(s): Marcel Mastenbroek
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NXE:3400B imaging performance assessed from a customer perspective
Author(s): Friso Wittebrood; Guido Schiffelers; Colette Legein
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Long collector mirror lifetime demonstration around 100W average LP-EUV source for semiconductor high volume manufacturing (Conference Presentation)
Author(s): Hakaru Mizoguchi; Hiroaki Nakarai; Tamotsu Abe; Yasufumi Kawasuji; Hiroshi Tanaka; Yukio Watanabe; Tsukasa Hori; Takeshi Kodema; Yutaka Shiraishi; Tatsuya Yanagida; George Soumangne; Tsuyoshi Yamada; Taku Yamazaki; Takashi Saitou
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Accelerator-based compact extreme ultraviolet (EUV) sources for lithography
Author(s): Juhao Wu; Alexander W. Chao
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Upgrade plan of cERL for the POC as a first stage of the development on EUV-FEL high power light source (Conference Presentation)
Author(s): Hiroshi Kawata; Norio Nakamura; Ryukou Kato
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EUV stochastic defect monitoring with advanced broadband optical wafer inspection and e-beam review systems
Author(s): Kaushik Sah; Andrew Cross; Martin Plihal; Vidyasagar Anantha; Raghav Babulnath; Derek Fung; Peter De Bisschop; Sandip Halder
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Non‐Gaussian CD distribution characterization for DRAM application in EUV lithography
Author(s): Alessandro Vaglio Pret; Inhwan Lee; Mijung Lim; David Blankenship; Trey Graves; Stewart A. Robertson; John J. Biafore
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Measurement and modeling of diffusion characteristics in EUV resist
Author(s): Luke Long; Andrew Neureuther; Patrick Naulleau
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Massive CD metrology for EUV failure characterization and EPE metrology
Author(s): Harm Dillen; Yi-Hsin Chang; Fei Wang; Marc Kea; Gijsbert Rispens; Marleen Kooiman; Fuming Wang; Stefan Hunsche; Daniel Tien; Peng Tang; Pengcheng Zhang
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Cleaning durability of the applied materials EUV mask blanks (Conference Presentation)
Author(s): Abbas Rastegar; Sankesha Bhoyar ; Khim Tiong Soon; Vik Banthia
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Ion beam processing for critical EUV photomask process steps: mask blank deposition and photomask absorber etch
Author(s): Katrina Rook; Meng H. Lee; Narasimhan Srinivasan; Vincent Ip; Sandeep Kohli; Mathew S. Levoso; Frank Cerio; Adrian J. Devasahayam
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Enabling enhanced EUV lithographic performance using advanced SMO, OPC, and RET
Author(s): Ana Armeanu; Vicky Philipsen; Fan Jiang; Germain Fenger; Neal Lafferty; Werner Gillijns; Eric Hendrickx; John Sturtevant
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Recent progress of materials and processes for EUV lithography. Ready for HVM? (Conference Presentation)
Author(s): Toru Fujimori
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Pattern formation mechanism of zirconia nanoparticle resist used for extreme-ultraviolet lithography (Conference Presentation)
Author(s): Takahiro Kozawa; Teppei Yamada; Satoshi Ishihara; Hiroki Yamamoto; Yusa Muroya; Julius J. S. Santillan; Toshiro Itani
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Progress in multi-trigger resists for EUV lithography (Conference Presentation)
Author(s): Carmen Popescu; Alexandra McClelland; Guy Dawson; John Roth; Yannick Vesters; Dimitrios Kazazis; Yasin Ekinci; Wolfgang Theis; Danilo De Simone; Geert Vandenberghe; Alex P. G. Robinson
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Evaluation of EUV resists for 5nm technology node and beyond
Author(s): Zuhal Tasdemir; Xiaolong Wang; Iacopo Mochi; Lidia van Lent-Protasova; Marieke Meeuwissen ; Rolf Custers; Gijsbert Rispens; Rik Hoefnagels; Yasin Ekinci
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Optimization and stability of CD variability in pitch 40 nm contact holes on NXE:3300
Author(s): Lieve Van Look ; Joost Bekaert; Andreas Frommhold; Eric Hendrickx; Gijsbert Rispens; Guido Schiffelers
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EUV pupil optimization for 32nm pitch logic structures
Author(s): D. Rio; V. Blanco; J.-H. Franke; W. Gillijns; M. Dusa; E. De Poortere; P. Van Adrichem; K. Lyakhova; C. Spence; E. Hendrickx; S. Biesemans; K. Nafus
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Rapid image-based pupil plane characterization for EUV lithography systems
Author(s): Zac Levinson; Erik Verduijn; Timothy Brunner; Obert Wood; Bruce W. Smith
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Phase defect inspection on EUV masks using RESCAN
Author(s): Rajendran Rajeev; Iacopo Mochi; Dimitrios Kazazis; Sara Fernandez; Tseng Li-Teng; Patrick Helfenstein; Yasin Ekinci
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Development of full-size EUV pellicle with thermal emission layer coating
Author(s): Juhee Hong; Chulkyun Park; Changhun Lee; Keesoo Nam; Yongju Jang; Seongju Wi; Jinho Ahn
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Actinic laboratory EUV tools for mask and pellicle metrology (Conference Presentation)
Author(s): Serhiy Danylyuk; Lukas Bahrenberg; Sascha Brose; Rainer Lebert; Jochen Stollenwerk; Peter Loosen
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EUV mask characterization with actinic scatterometry
Author(s): Stuart Sherwin; Andrew Neureuther; Patrick Naulleau
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State-of-the-art of EUV materials for N5 logic and DRAM applications
Author(s): Danilo De Simone; Yannick Vesters; Pieter Venelderen; Xue Ran; Ivan Pollentier; Geert Vandenberghe
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Using resonant soft x-ray scattering to image patterns on undeveloped resists
Author(s): Guillaume Freychet; Isvar A. Cordova; Terry McAfee; Dinesh Kumar; Ronald J. Pandolfi; Chris Anderson; Patrick Naulleau; Cheng Wang; Alexander Hexemer
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Advances in metal oxide resist performance and production (Conference Presentation)
Author(s): Jason K. Stowers
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New resist and underlayer approaches toward EUV lithography
Author(s): Juha Rantala; Thomas Gädda; Markus Laukkanen; Luong Nguyen Dang; Kimmo Karaste; Dimitrios Kazizis; Yasin Ekinci
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Advanced development of organic and inorganic under layers for EUV lithography (Conference Presentation)
Author(s): Wataru Shibayama; Shuhei Shigaki; Satoshi Takeda; Mamoru Tamura; Yasunobu Someya; Makoto Nakajima; Rikimaru Sakamoto
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High-NA EUV lithography exposure tool progress (Conference Presentation)
Author(s): Jan van Schoot; Eelco van Setten; Kars Troost; Frank Bornebroek; Rob van Ballegoij; Sjoerd Lok; Judon Stoeldraijer; Jo Finders; Hans Meiling; Paul Graeupner; Peter Kuerz; Winfried Kaiser; Erik Loopstra; Bernhard Kneer; Sascha Migura
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High-NA EUV lithography: The next step in EUV imaging (Conference Presentation)
Author(s): Eelco van Setten; John McNamara; Jan van Schoot; Gerardo Bottiglieri; Kars Troost; Timon Fliervoet; Stephen Hsu; Jörg Zimmermann; Jens-Timo Neumann; Matthias Rösch; Paul Graeupner
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Berkeley MET5 update: commissioning, interferometry, and first prints (Conference Presentation)
Author(s): Ryan H. Miyakawa; Wenhua Zhu; Geoff Gaines; Chris Anderson; Patrick Naulleau
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Mask 3D effects experimental measurements with NA 0.55 anamorphic imaging (Conference Presentation)
Author(s): Vincent Wiaux; Vicky Philipsen; Eric Hendrickx
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Integration via 3rd dimension: 3D power scaling
Author(s): Paolo A. Gargini
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Benchmarking of EUV lithography line/space patterning versus immersion lithography multipatterning schemes at equivalent pitch
Author(s): Angélique Raley; Chris Mack; Sophie Thibaut; Eric Liu; Akiteru Ko
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Study of resist hardmask interaction through surface activation layers
Author(s): Anuja De Silva; Luciana Meli; Jing Guo; Jennifer Church; Nelson M. Felix; Dario L. Goldfarb; Bharat Kumar; Rudy J. Wojtecki; Magi Mettry; Alexander Hess
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Optimization of absorber and multilayer in EUV mask for 1D and 2D patterns
Author(s): Zhizhen Yang; Taian Fan; Lisong Dong; Yayi Wei; Yanrong Wang; Jing Zhang; Jiang Yan
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Holographic masks for computational proximity lithography with EUV radiation
Author(s): V. Deuter; M. Grochowicz; S. Brose; J. Biller; S. Danylyuk; T. Taubner; D. Grützmacher; L. Juschkin
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Extreme ultraviolet pellicle cooling by hydrogen gas flow (Conference Presentation)
Author(s): Hye-Lim Lee; Sung-Gyu Lee; Jae-Hun Park; Hye-Keun Oh
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A tool for full area inband EUV transmission mapping of EUV pellicles
Author(s): C. Pampfer; A. Biermanns-Föth; T. Missalla; J. Arps; C. Phiesel; C. Piel; R. Lebert
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Pattern degradation with larger particles on EUV pellicle
Author(s): Hee-Ra No; Sung-Gyu Lee; Se-Hun Oh; Hye-Keun Oh
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Defect avoidance for extreme ultraviolet mask defects using intentional pattern deformation
Author(s): Yoo-Jin Chae; Rik Jonckheere; Puneet Gupta
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AIMER™: full reticle area, scanner-effective EUV mapping reflectometry
Author(s): A. Biermanns-Föth; C. Phiesel; T. Missalla; J. Arps; C. Piel; R. Lebert
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Operational and productization status of Adlyte’s light source for actinic patterned mask inspection HVM tools (Conference Presentation)
Author(s): Fariba Abhari
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NXE:3400B EUV source performance in the field, readiness for HVM and power scaling beyond 250W
Author(s): Igor V. Fomenkov; Michael A. Purvis; Alexander A. Schafgans; Yezheng Tao; Slava Rokitski; Jayson Stewart; Andrew LaForge; Alexander I. Ershov; Robert J. Rafac; Silvia De Dea; Chirag Rajyaguru; Georgiy O. Vaschenko; Mathew Abraham; David C. Brandt; Daniel J. Brown
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Key components development progress of high-power LPP-EUV light source with unique debris mitigation system using a magnetic field
Author(s): Yuichi Nishimura; Tsukasa Hori; Takayuki Yabu; Katsuhiko Wakana; Yoshifumi Ueno; Georg Soumagne; Shinji Nagai; Tatsuya Yanagida; Yasufumi Kawasuji; Yutaka Shiraishi; Tamotsu Abe; Hiroaki Nakarai; Takashi Saito; Hakaru Mizoguchi
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Debris-free high-brightness light source based on LPP for actinic EUV microscopy and metrology applications
Author(s): Konstantin Koshelev; Alexander Vinokhodov; Oleg Yakushev; Alexey Yakushkin; Dimitri Abramenko; Alexander Lash; Mikhail Krivokorytov; Yuri Sidelnikov; Vladimir Ivanov; Vladimir Krivtsun; Vyacheslav Medvedev; Denis Glushkov; Pavel Seroglazov; Samir Ellwi; Rainer Lebert
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A possible wafer heating during EUV exposure
Author(s): Se-Hun Oh; Sung-Gyu Lee; Jae-Hun Park; Chung-Hyun Ban; Hye-Keun Oh
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Lateral shearing interferometry for high-NA EUV wavefront metrology
Author(s): Wenhua Zhu; Ryan Miyakawa; Lei Chen; Patrick Naulleau
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Reflectance measurement of EUV mirrors with s- and p-polarized light using polarization control units
Author(s): Tetsuo Harada; Takeo Watanabe
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Spatially resolved reflectometry for EUV optical components
Author(s): Frank Scholze; Andreas Fischer; Claudia Tagbo; Christian Buchholz; Victor Soltwisch; Christian Laubis
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Actinic tools for EUV resist characterization in research and production
Author(s): R. Lebert; T. Missalla; C. Phiesel; C. Piel; S. Brose; S. Danylyuk; P. Loosen; K. Bergmann; J. Vieker
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In-situ measurement of outgassing generated from EUV metal oxide nanoparticles resist during electron irradiation
Author(s): Y. Minami; S. Takahashi; H. Minami; Y. Matsumoto; M. Kadoi; A. Sekiguchi; T. Watanabe
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EUV sensitizer for resists and spin-on-carbon materials
Author(s): Takashi Sato; Yuta Togashi; Sachiko Shinjo; Takumi Toida; Takashi Makinoshima; Masatoshi Echigo
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Development of absorption-coefficient-measurement method of EUV resist by direct-resist coating on a photodiode
Author(s): Shota Niihara; Tetsuo Harada; Takeo Watanabe
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Studying resist performance for contact holes printing using EUV interference lithography
Author(s): Xiaolong Wang; Li-Ting Tseng; Dimitrios Kazazis; Zuhal Tasdemir ; Michaela Vockenhuber; Iacopo Mochi; Yasin Ekinci
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Study of roughness components in the frequency domain via experimental and simulated images (Conference Presentation)
Author(s): Alessandro Vaglio Pret; John J. Biafore; Chris A. Mack
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Track based techniques to improve high-resolution EUV patterning defectivity
Author(s): Naoki Shibata; Lior Huli; Corey Lemley; Dave Hetzer; Eric Liu; Ko Akiteru; Shinichiro Kawakami; Karen Petrillo; Luciana Meli; Nelson Felix; Cody Murray; Alex Hubbard; Rick Johnson
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Improvement of CD stability and defectivity in resist coating and developing process in EUV lithography process
Author(s): Yuya Kamei; Shinichiro Kawakami; Masahide Tadokoro; Yusaku Hashimoto; Takeshi Shimoaoki; Masashi Enomoto; Kathleen Nafus; Akihiro Sonoda; Philippe Foubert
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