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PROCEEDINGS VOLUME 10585

Metrology, Inspection, and Process Control for Microlithography XXXII
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Volume Details

Volume Number: 10585
Date Published: 26 April 2018

Table of Contents
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Front Matter: Volume 10585
Author(s): Proceedings of SPIE
Extensibility of optics-based metrology for sub-5nm technology (Conference Presentation)
Author(s): Bryan M. Barnes; Richard M. Silver; Scott Schmucker; Hui Zhou; Mark-Alexander Henn; Martin Y. Sohn
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Scatterometry for gate all around (GAA) technology enablement (Conference Presentation)
Author(s): Anne-Laure Charley; Hans Mertens; Naoto Horiguchi ; Philippe Leray; Nivea Figueiró; Matthew Sendelbach; Roy Koret; Avron Ger; Shay Wolfling
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Mueller matrix spectroscopic ellipsometry based scatterometry simulations of Si and Si/SixGe1-x/Si/SixGe1-x/Si fins for sub-7nm node gate-all-around transistor metrology
Author(s): Sonal Dey; Alain Diebold; Nick Keller; Madhulika Korde
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Study of µDBO overlay target size reduction for application broadening
Author(s): Victor Calado; Jérôme Dépré; Clément Massacrier; Sergey Tarabrin; Richard van Haren; Florent Dettoni; Régis Bouyssou; Christophe Dezauzier
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Defect inspection using a time-domain mode decomposition technique
Author(s): Jinlong Zhu; Lynford L. Goddard
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High-throughput defect inspection for arbitrarily shaped EUV absorber patterns (Conference Presentation)
Author(s): Patrick Helfenstein; Iacopo Mochi; Rajendran Rajeev; Sara Fernandez; Dimitrios Kazazis; Yasin Ekinci
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Optimizing defect detectability across multiple ultraviolet wavelengths (Conference Presentation)
Author(s): Mark-Alexander Henn; Bryan M. Barnes; Hui Zhou; Richard M. Silver
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Contact inspection of Si nanowire with SEM voltage contrast
Author(s): Takeyoshi Ohashi; Atsuko Yamaguchi; Kazuhisa Hasumi; Masami Ikota; Gian Lorusso; Naoto Horiguchi
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Through-focus scanning optical microscopy (TSOM) with adaptive optics
Author(s): Jun Ho Lee; Gyunam Park; Junhee Jeong; Chris Park
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The need for LWR metrology standardization: the imec roughness protocol
Author(s): Gian Francesco Lorusso; Takumichi Sutani ; Vito Rutigliani; Frieda van Roey; Alain Moussa; Anne-Laure Charley; Chris Mack; Patrick Naulleau; Vassilios Constantoudis ; Masami Ikota ; Toru Ishimoto; Shunsuke Koshihara
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Line-width roughness of advanced semiconductor features by using FIB and planar-TEM as reference metrology
Author(s): Kiyoshi Takamasu; Satoru Takahashi; Hiroki Kawada; Masami Ikota
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Programmed LWR metrology by multi-techniques approach
Author(s): Jérôme Reche; Maxime Besacier; Patrice Gergaud; Yoann Blancquaert; Guillaume Freychet; Thibault Labbaye
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CD-SEM algorithm optimization for line roughness metrology (Conference Presentation)
Author(s): Chris A. Mack; Ben Bunday
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Measurement of pattern roughness and local size variation using CD-SEM: current status
Author(s): Hiroshi Fukuda; Takahiro Kawasaki; Hiroki Kawada; Kei Sakai; Takashi Kato; Satoru Yamaguchi; Masami Ikota; Yoshinori Momonoi
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7/5nm logic manufacturing capabilities and requirements of metrology
Author(s): Benjamin Bunday; A. F. Bello; Eric Solecky; Alok Vaid
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Extraction of CDs and side wall angles from top down SEM images of double layered structures (Conference Presentation)
Author(s): Sergey Babin; Leia Guo; Igor Ivonin; Yi Huang
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Complex EUV imaging reflectometry: spatially resolved 3D composition determination and dopant profiling with a tabletop 13nm source
Author(s): Christina L. Porter; Michael Tanksalvala; Michael Gerrity; Galen P. Miley; Yuka Esashi; Naoto Horiguchi; Xiaoshi Zhang; Charles S. Bevis; Robert Karl; Peter Johnsen; Daniel E. Adams; Henry C. Kapteyn; Margaret M. Murnane
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Characterization and imaging of nanostructured materials using tabletop extreme ultraviolet light sources
Author(s): Robert Karl; Joshua Knobloch; Travis Frazer; Michael Tanksalvala; Christina Porter; Charles Bevis; Weilun Chao; Begoña Abad Mayor; Daniel Adams; Giulia F. Mancini; Jorge N. Hernandez-Charpak; Henry Kapteyn; Margaret Murnane
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Image-based overlay measurement using subsurface ultrasonic resonance force microscopy
Author(s): M. S. Tamer; M. J. van der Lans; H. Sadeghian
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EUV-angle resolved scatter (EUV-ARS): a new tool for the characterization of nanometre structures
Author(s): Analía Fernández Herrero; Heiko Mentzel; Victor Soltwisch; Sina Jaroslawzew; Christian Laubis; Frank Scholze
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X-ray EM simulation tool for ptychography dataset construction
Author(s): L. Pjotr Stoevelaar; Giampiero Gerini
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Image-based overlay and alignment metrology through optically opaque media with sub-surface probe microscopy
Author(s): Maarten H. van Es; Abbas Mohtashami; Daniele Piras; Hamed Sadeghian
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Spectral tunability for accuracy, robustness, and resilience
Author(s): Einat Peled; Eran Amit; Yuval Lamhot; Alexander Svizher; Dana Klein; Anat Marchelli; Roie Volkovich; Tal Yaziv; Aaron Cheng; Honggoo Lee; Sangjun Han; Minhyung Hong; Seungyoung Kim; Jieun Lee; Dongyoung Lee; Eungryong Oh; Ahlin Choi; DongSub Choi; DoHwa Lee; Sanghuck Jeon; Jungtae Lee; Seongjae Lee; Zephyr Liu; Jeongpyo Lee; John C. Robinson
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Holistic metrology qualification extension and its application to characterize overlay targets with asymmetric effects
Author(s): Olavio Dos Santos Ferreira; Reza Sadat Gousheh; Bart Visser; Kenrick Lie; Rachel Teuwen; Pavel Izikson; Grzegorz Grzela; Babak Mokaberi; Steve Zhou; Justin Smith; Danish Husain; Ram S. Mandoy; Raul Olvera
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Overlay and stitching metrology for massively parallel electron-beam lithography
Author(s): Guido Rademaker; Jonathan Pradelles; Stéfan Landis; Stephane Rey; Anna Golotsvan; Anat Marchelli; Tal Itzkovich; Tetyana Shapoval; Ronny Haupt; Erwin Slot; Guido de Boer; Dhara Dave; Marco Wieland; Laurent Pain
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Unique method for controlling device level overlay with high-NA optical overlay technique using YieldStar in a DRAM HVM environment
Author(s): Dong-Kiu Park; Hyun-Sok Kim; Moo-Young Seo; Jae-Wuk Ju; Young-Sik Kim; Mir Shahrjerdy; Arno van Leest; Aileen Soco; Giacomo Miceli; Jennifer Massier; Elliott McNamara; Paul Hinnen; Paul Böcker; Nang-Lyeom Oh; Sang-Hoon Jung; Yvon Chai; Jun-Hyung Lee
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CD-SEM real time bias correction using reference metrology based modeling
Author(s): V. Ukraintsev; W. Banke; G. Zagorodnev; C. Archie; N. Rana; V. Pavlovsky; V. Smirnov; I. Briginas; A. Katnani; A. Vaid
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Implementation of machine learning for high-volume manufacturing metrology challenges
Author(s): Padraig Timoney; Taher Kagalwala; Edward Reis; Houssam Lazkani; Jonathan Hurley; Haibo Liu; Charles Kang; Paul Isbester; Naren Yellai; Michael Shifrin; Yoav Etzioni
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Deep machine learning based Image classification in hard disk drive manufacturing
Author(s): Narender Rana; Chester Chien
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Novel hybrid metrology for process integration of gate all around (GAA) devices (Conference Presentation)
Author(s): Gangadhara R. Muthinti; Nicolas Loubet; Robinhsinkuo Chao; Abraham Arceo De La Pena; Dexin Kong; Juntao Li; Brock Mendoza; Veeraraghavan Basker; Tenko Yamashita; John Gaudiello; Matthew Sendelbach; Aron J. Cepler; Susan Ng-Emans; Gilad Barak; Wei Ti Lee
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In-line characterization of non-selective SiGe nodule defects with scatterometry enabled by machine learning
Author(s): Dexin Kong; Robin Chao; Mary Breton; Chi-chun Liu; Gangadhara Raja Muthinti; Soon-cheon Seo; Nicolas J. Loubet; Pietro Montanini; John Gaudiello; Veeraraghavan Basker; Aron Cepler; Susan Ng-Emans; Matthew Sendelbach; Itzik Kaplan; Gilad Barak; Daniel Schmidt; Julien Frougier
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A holistic metrology sensitivity study for pattern roughness quantification on EUV patterned device structures with mask design induced roughness
Author(s): Shimon Levi; Ishai Swrtsband; Vladislav Kaplan; Ilan Englard; Kurt Ronse; Bogumila Kutrzeba-Kotowska ; Gaoliang Dai; Frank Scholze; Kenslea Anne; Hayley Johanesen; Laurens Kwakman; Igor Turovets; Maxim Rabinovitch; Sven Krannich; Nikolai Kasper; Brid Connolly; Romy Wende; Markus Bender
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Critical-dimension grazing incidence small angle x-ray scattering
Author(s): G. Freychet; D. Kumar; R. Pandolfi; D. Staacks; P. Naulleau; R. J. Kline; D. Sunday ; M. Fukuto; J. Strzalka; A. Hexemer
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Context-based virtual metrology
Author(s): Peter Ebersbach; Adam M. Urbanowicz; Dmitriy Likhachev; Carsten Hartig; Michael Shifrin
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Predicting back-end writer main pole shape geometry from wafer metrology data in hard disk drive manufacturing
Author(s): Narender Rana; Chester Chien
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High repeatability CD-SEM metrology of disk drive writer and extraction of SWA (Conference Presentation)
Author(s): Narender Rana; Anhhuy Ngo; Chester Chien; Sergey Babin; Igor Ivonin
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Modeling of electron-specimen interaction in scanning electron microscope for e-beam metrology and inspection: challenges and perspectives
Author(s): Makoto Suzuki; Toshimasa Kameda; Ayumi Doi; Sergey Borisov; Sergey Babin
Show Abstract
Model improvements to simulate charging in SEM
Author(s): K. T. Arat; T. Klimpel; C. W. Hagen
Show Abstract
Advanced CD-SEM solution for edge placement error characterization of BEOL pitch 32nm metal layers
Author(s): A. Charley; P. Leray; G. Lorusso; T. Sutani; Y. Takemasa
Show Abstract
Influence of e-beam aperture angle on CD-SEM measurements for high-aspect ratio structure
Author(s): Daisuke Bizen; Makoto Sakakibara; Makoto Suzuki; Uki Ikeda; Shunsuke Mizutani; Kouichi Kurosawa; Hajime Kawano
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Yield impact for wafer shape misregistration-based binning for overlay APC diagnostic enhancement
Author(s): David Jayez; Kevin Jock; Yue Zhou; Venugopal Govindarajulu; Zhen Zhang; Fatima Anis; Felipe Tijiwa-Birk; Shivam Agarwal
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Approaches of multilayer overlay process control for 28nm FD-SOI derivative applications
Author(s): Benjamin Duclaux; Jean De Caunes; Robin Perrier; Maxime Gatefait; Bertrand Le Gratiet; Jean-Damien Chapon; Cédric Monget
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In-cell overlay metrology by using optical metrology tool
Author(s): Honggoo Lee ; Sangjun Han; Minhyung Hong; Seungyoung Kim; Jieun Lee; DongYoung Lee; Eungryong Oh; Ahlin Choi; Hyowon Park; Waley Liang; DongSub Choi; Nakyoon Kim; Jeongpyo Lee; Stilian Pandev; Sanghuck Jeon; John C. Robinson
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Matching between simulations and measurements as a key driver for reliable overlay target design
Author(s): S. Lozenko; T. Shapoval; G. Ben-Dov; Z. Lindenfeld; B. Schulz ; L. Fuerst; C. Hartig; R. Haupt; M. Ruhm; R. Wang
Show Abstract
Multi-wavelength approach towards on-product overlay accuracy and robustness
Author(s): Kaustuve Bhattacharyya; Marc Noot; Hammer Chang; Sax Liao; Ken Chang; Benny Gosali; Eason Su; Cathy Wang; Arie den Boef; Christophe Fouquet; Guo-Tsai Huang; Kai-Hsiung Chen; Kevin Cheng; John Lin
Show Abstract
Advanced combined overlay and CD uniformity measurement mark for double patterning
Author(s): Hsiao Lin Hsu; En Chuan Lio; Charlie Chen; Jia Hung Chang; Sho Shen Lee; Stefan Buhl; Manuela Gutsch; Patrick Lomtscher; Martin Freitag; Boris Habets; Rex Liu
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Enabling optical metrology on small 5x5um2 in-cell targets to support flexible sampling and higher order overlay and CD control for advanced logic devices nodes
Author(s): Antonio Salerno; Isabel de la Fuente; Zack Hsu; Alan Tai; Hammer Chang; Elliott McNamara; Hugo Cramer; Daoping Li
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Spectroscopic vector analysis for fast pattern quality monitoring
Author(s): Younghoon Sohn; Sungyoon Ryu; Chihoon Lee; Yusin Yang
Show Abstract
Setting up a proper power spectral density (PSD) and autocorrelation analysis for material and process characterization
Author(s): Vito Rutigliani; Gian Francesco Lorusso; Danilo De Simone; Frederic Lazzarino; Gijsbert Rispens ; George Papavieros; Evangelos Gogolides; Vassilios Constantoudis; Chris A. Mack
Show Abstract
Holistic approach for overlay and edge placement error to meet the 5nm technology node requirements
Author(s): Jan Mulkens; Bram Slachter; Michael Kubis; Wim Tel; Paul Hinnen; Mark Maslow; Harm Dillen; Eric Ma; Kevin Chou; Xuedong Liu; Weiming Ren; Xuerang Hu; Fei Wang; Kevin Liu
Show Abstract
A novel patterning control strategy based on real-time fingerprint recognition and adaptive wafer level scanner optimization
Author(s): Hakki Ergun Cekli; Jelle Nije; Alexander Ypma; Vahid Bastani; Dag Sonntag; Henk Niesing; Linmiao Zhang; Zakir Ullah; Venky Subramony; Ravin Somasundaram; William Susanto; Masazumi Matsunobu; Jeff Johnson; Cyrus Tabery; Chenxi Lin; Yi Zou
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Scanner focus metrology and control system for advanced 10nm logic node
Author(s): Junghun Oh; Kwang-Seok Maeng ; Jae-Hyung Shin; Won-Woong Choi; Sung-Keun Won; Cedric Grouwstra; Mohamed El Kodadi; Stephan Heil; Vidar van der Meijden; Jong Kyun Hong ; Sang-Jin Kim; Oh-Sung Kwon
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Computational metrology: enabling full-lot high-density fingerprint information without adding wafer metrology budget, and driving improved monitoring and process control
Author(s): Hyun-Sok Kim; Min-Sung Hyun; Jae-Wuk Ju; Young-Sik Kim; Cees Lambregts; Peter van Rhee; Johan Kim; Elliott McNamara; Wim Tel; Paul Böcker; Nang-Lyeom Oh; Jun-Hyung Lee
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Correlation study of actual temperature profile and in-line metrology measurements for within-wafer uniformity improvement and wafer edge yield enhancement
Author(s): Fang Fang; Alok Vaid; Alina Vinslava; Richard Casselberry; Shailendra Mishra; Dhairya Dixit; Padraig Timoney; Dinh Chu; Candice Porter; Da Song; Zhou Ren
Show Abstract
Higher order intra-field alignment for intra-wafer lens and reticle heating control
Author(s): Charlie Chen; En-Chuan Lio; Hsiao Lin Hsu; Jia Hung Chang; Sho Shen Lee; Patrick Lomtscher; Boris Habets; Georg Erley; Norman Birnstein; Steven Tottewitz; Rex Liu
Show Abstract
Outlier detection in contamination control
Author(s): Jeffrey Weintraub; Scott Warrick
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Understanding overlay signatures using machine learning on non-lithography context information
Author(s): Marshall Overcast; Corey Mellegaard; David Daniel; Boris Habets; Georg Erley; Steffen Guhlemann; Xaver Thrun; Stefan Buhl; Steven Tottewitz
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LMS IPRO: Enabling local registration measurements for efficient e-beam writer correction
Author(s): Hendrik Steigerwald; Oliver Ache; Runyuan Han; Frank Laske; Klaus-Dieter Roeth
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Allowable SEM noise for unbiased LER measurement
Author(s): George Papavieros; Vassilios Constantoudis; Evangelos Gogolides
Show Abstract
Study on the dark-field illumination for near-field microscope using anamorphic optics to inspect defects on semiconductor wafers
Author(s): Woojun Han; Sunseok Yang; Hangyeong Oh; Yoongi Lee; Jaisoon Kim
Show Abstract
Advanced technique for ultra-thin residue inspection with sub-10nm thickness using high-energy back-scattered electrons
Author(s): Jin-Hee Han
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Advanced CD-SEM imaging methodology for EPE measurements
Author(s): Yoshikata Takemasa; Takeyoshi Ohashi; Hiroyuki Shindo; Gian Lorusso; Anne-Laure Charley
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Unbiased roughness measurements: the key to better etch performance
Author(s): Andrew Liang; Chris Mack; Stephen Sirard; Chen-wei Liang; Liu Yang; Justin Jiang; Nader Shamma; Rich Wise; Jengyi Yu; Diane Hymes
Show Abstract
Assessment of local variability by high-throughput e-beam metrology for prediction of patterning defect probabilities
Author(s): Fuming Wang ; Stefan Hunsche; Roy Anunciado; Antonio Corradi ; Hung Yu Tien; Peng Tang; Junwei Wei; Yongjun Wang; Wei Fang; Patrick Wong; Anton van Oosten; Koen van Ingen Schenau; Bram Slachter
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How to measure a-few-nanometer-small LER occurring in EUV lithography processed feature
Author(s): Hiroki Kawada; Takahiro Kawasaki; Junichi Kakuta; Masami Ikota; Tsuyoshi Kondo
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Improved control of multi-layer overlay in advanced 8nm logic nodes
Author(s): Tae-Sun Kim; Young-Sik Park; Yong-Chul Kim; Byoung-Hoon Kim; Ji-Hun Lee; Min-Keun Kwak; Sung-Won Choi; Joon-Soo Park; Hong-Cheon Yang; Philipp Meixner; Dong-jin Lee; Oh-Sung Kwon; Hyun-Su Kim; Jin-Tae Park; Sung-Min Lee; Cedric Grouwstra; Vidar van der Meijden; Mohamed El Kodadi; Chris Kim; Pierre-Yves Guittet; Tjitte Nooitgedagt
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Monte Carlo simulation of edge placement error
Author(s): Shinji Kobayashi; Soichiro Okada; Satoru Shimura; Kathleen Nafus; Carlos Fonseca; Joel Estrella; Masashi Enomoto
Show Abstract
Clean focus, dose and CD metrology for CD uniformity improvement
Author(s): Honggoo Lee ; Sangjun Han; Minhyung Hong; Seungyoung Kim; Jieun Lee; DongYoung Lee; Eungryong Oh; Ahlin Choi; Nakyoon Kim; John C. Robinson; Markus Mengel ; Rovira Pablo ; Sungchul Yoo; Raphael Getin; Dongsub Choi; Sanghuck Jeon
Show Abstract
Overlay of multiframe SEM images including nonlinear field distortions
Author(s): S. Babin; S. Borisov; I. Ivonin; S. Nakazawa; Y. Yamazaki
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Geometry-based across wafer process control in a dual damascene scenario
Author(s): Gerd Krause; Detlef Hofmann; Boris Habets; Stefan Buhl; Manuela Gutsch; Alberto Lopez-Gomez; Xaver Thrun
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Advanced defect classification by smart sampling, based on sub-wavelength anisotropic scatterometry
Author(s): Peter van der Walle; Esther Kramer; Rob Ebeling; Helma Spruit; Paul Alkemade; Silvania Pereira; Jacques van der Donck; Diederik Maas
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Developing a flexible model of electron scattering in solid for charging analysis
Author(s): Chahn Lee; Toshiyuki Yokosuka; Hideyuki Kazumi
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Design optimization of highly asymmetrical layouts by 2D contour metrology
Author(s): C. M. Hu; Fred Lo; Elvis Yang; T. H. Yang; K. C. Chen
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I-line stepper based overlay evaluation method for wafer bonding applications
Author(s): P. Kulse; K. Sasai; K. Schulz; M. Wietstruck
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Backscattered electron simulations to evaluate sensitivity against electron dosage of buried semiconductor features
Author(s): Maseeh Mukhtar; Bradley Thiel
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Prototype through-pellicle coherent imaging using a 30nm tabletop EUV source
Author(s): Charles S. Bevis; Robert M. Karl; Bin Wang; Yuka Esashi; Michael Tanksalvala; Christina L. Porter; Peter Johnsen; Daniel E. Adams; Margaret M. Murnane; Henry C. Kapteyn
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Massive metrology using fast e-beam technology improves OPC model accuracy by >2x at faster turnaround time
Author(s): Qian Zhao; Lei Wang; Jazer Wang; ChangAn Wang; Hong-Fei Shi; James Guerrero; Mu Feng; Qiang Zhang; Jiao Liang; Yunbo Guo; Chen Zhang; Tom Wallow; David Rio; Lester Wang; Alvin Wang; Jen-Shiang Wang; Keith Gronlund; Jun Lang; Kar Kit Koh; Dong Qing Zhang; Hongxin Zhang; Subramanian Krishnamurthy; Ray Fei; Chiawen Lin; Wei Fang; Fei Wang
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Cognitive learning: a machine learning approach for automatic process characterization from design
Author(s): J. Foucher; J. Baderot; S. Martinez; A. Dervilllé; G. Bernard
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A new way of measuring wiggling pattern in SADP for 3D NAND technology
Author(s): Jian Mi; Ziqi Chen; Li Ming Tu; Xiaoming Mao; Gong Cai Liu; Hiroki Kawada
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In-depth analysis and characterization of a dual damascene process with respect to different CD
Author(s): Gerd Krause; Detlef Hofmann; Boris Habets; Stefan Buhl; Manuela Gutsch; Alberto Lopez-Gomez; Wan-Soo Kim; Xaver Thrun
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Automated AFM for small-scale and large-scale surface profiling in CMP applications
Author(s): Ardavan Zandiatashbar; Byong Kim; Young-kook Yoo; Keibock Lee; Ahjin Jo; Ju Suk Lee; Sang-Joon Cho; Sang-il Park
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Quantitative approach for optimizing e-beam condition of photoresist inspection and measurement
Author(s): Chia-Jen Lin; Chia-Hao Teng; Po-Chung Cheng; Yoshishige Sato; Shang-Chieh Huang; Chu-En Chen; Kotaro Maruyama; Yuichiro Yamazaki
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Toward reliable and repeatable automated STEM-EDS metrology with high throughput
Author(s): Zhenxin Zhong; Jason Donald; Gavin Dutrow; Justin Roller; Ozan Ugurlu; Martin Verheijen; Oleksii Bidiuk
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Tracking the defects of ultra-thin HfO2 using a Cody-Lorentz multiple oscillator model
Author(s): Dawei Hu; Aaron J. Rosenberg; Houssam Chouaib; Natalia Malkova; Zhengquan Tan
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Feed-forward alignment correction for advanced overlay process control using a standalone alignment station "Litho Booster"
Author(s): Takehisa Yahiro; Junpei Sawamura; Tomonori Dosho; Yuji Shiba; Satoshi Ando; Jun Ishikawa; Masahiro Morita; Yuichi Shibazaki
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Automated mask and wafer defect classification using a novel method for generalized CD variation measurements
Author(s): V. Verechagin; R. Kris; I. Schwarzband; A. Milstein; B. Cohen; A. Shkalim; S. Levy; D. Price; E. Bal
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Accuracy optimization with wavelength tunability in overlay imaging technology
Author(s): Honggoo Lee; Yoonshik Kang; Sangjoon Han; Kyuchan Shim; Minhyung Hong; Seungyoung Kim; Jieun Lee; Dongyoung Lee; Eungryong Oh; Ahlin Choi; Youngsik Kim; Tal Marciano; Dana Klein; Eitan M. Hajaj; Sharon Aharon ; Guy Ben-Dov ; Saltoun Lilach; Dan Serero; Anna Golotsvan
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Shot-noise limited throughput of soft x-ray ptychography for nanometrology applications
Author(s): Wouter Koek; Bastiaan Florijn; Stefan Bäumer; Rik Kruidhof; Hamed Sadeghian
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Multifractal analysis of line-edge roughness
Author(s): Vassilios Constantoudis; George Papavieros; Gian Lorusso; Vito Rutigliani; Frieda van Roey; Evangelos Gogolides
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Cutting edge multiple beam technology for EUV era: latest development progress and application
Author(s): Eric Ma; Kevin Chou; Xuedong Liu; Weiming Ren; Xuerang Hu; Fei Wang; Kevin Liu
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