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PROCEEDINGS VOLUME 10583

Extreme Ultraviolet (EUV) Lithography IX
Editor(s): Kenneth A. Goldberg
For the purchase of this volume in printed format, please visit Proceedings.com

Volume Details

Volume Number: 10583
Date Published: 22 May 2018

Table of Contents
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Front Matter: Volume 10583
Author(s): Proceedings of SPIE
Moore's law, lithography, and how optics drive the semiconductor industry
Author(s): G. Dan Hutcheson
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EUV photolithography: resist progress and challenges
Author(s): Christopher K. Ober; Hong Xu; Vasiliki Kosma; Kazunori Sakai; Emmanuel P. Giannelis
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Sensitizers in EUV chemically amplified resist: mechanism of sensitivity improvement
Author(s): Yannick Vesters; Jing Jiang; Hiroki Yamamoto; Danilo De Simone; Takahiro Kozawa; Stefan De Gendt; Geert Vandenberghe
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Multi-trigger resist patterning with ASML NXE3300 EUV scanner
Author(s): Yannick Vesters; Alexandra McClelland; Danilo De Simone; Carmen Popescu; Guy Dawson; John Roth; Wolfgang Theis; Geert Vandenberghe; Alex P. G. Robinson
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Role of excess ligand and effect of thermal treatment in hybrid inorganic-organic EUV resists
Author(s): Eric C. Mattson; Sara M. Rupich; Yasiel Cabrera; Yves J. Chabal
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Ti, Zr, and Hf-based molecular hybrid materials as EUV photoresists
Author(s): Sonia Castellanos; Lianjia Wu; Milos Baljozovic; Giuseppe Portale; Dimitrios Kazazis; Michaela Vockenhuber; Yasin Ekinci; Thomas Jung
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Recent status of resist outgas testing for metal containing resists at EIDEC
Author(s): Eishi Shiobara; Shinji Mikami; Kenji Yamada
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EPE fundamentals and impact of EUV: Will traditional design-rule calculations work in the era of EUV?
Author(s): Allen H. Gabor; Andrew C. Brendler; Timothy A. Brunner; Xuemei Chen; James A. Culp; Harry J. Levinson
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Holistic analysis of aberration induced overlay error in EUV lithography
Author(s): Yulu Chen; Lars Liebmann; Lei Sun; Allen Gabor; Shuo Zhao; Feixiang Luo; Obert Wood II; Xuemei Chen; Daniel Schmidt; Michael Kling; Francis Goodwin
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Defect detection strategies and process partitioning for SE EUV patterning
Author(s): Luciana Meli; Karen Petrillo; Anuja De Silva; John Arnold; Nelson Felix; Chris Robinson; Benjamin Briggs; Shravan Matham; Yann Mignot; Jeffrey Shearer; Bassem Hamieh; Koichi Hontake; Lior Huli; Corey Lemley; Dave Hetzer; Eric Liu; Ko Akiteru; Shinichiro Kawakami; Takeshi Shimoaoki; Yusaku Hashimoto; Hiroshi Ichinomiya; Akiko Kai; Koichiro Tanaka; Ankit Jain; Heungsoo Choi; Barry Saville; Chet Lenox
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Characterization and control of EUV scanner dose uniformity and stability
Author(s): Chris Robinson; Dan Corliss; Luciana Meli; Rick Johnson
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EUV photoresist patterning characterization for imec N7/N5 technology
Author(s): Danilo De Simone; Vito Rutigliani; Gian Lorusso; Peter De Bisschop; Yannick Vesters; Victor Blanco Carballo; Geert Vandenberghe
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EUV for HVM: towards an industrialized scanner for HVM NXE3400B performance update
Author(s): Roderik van Es; Mark van de Kerkhof; Arthur Minnaert; Geert Fisser; Jos de Klerk; Joost Smits; Roel Moors; Eric Verhoeven; Leon Levasier; Rudy Peeters; Marco Pieters; Hans Meiling
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EUV vote-taking lithography: crazy... or not?
Author(s): Joost Bekaert; Peter De Bisschop; Christophe Beral; Eric Hendrickx; Mark A. van de Kerkhof; Sander Bouten; Michiel Kupers; Guido Schiffelers; Erik Verduijn; Timothy A. Brunner
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Evaluation of EUV mask impacts on wafer line-edge roughness using aerial and SEM image analyses
Author(s): Xuemei Chen; Erik Verduijn; Obert Wood; Timothy Brunner; Renzo Capelli; Dirk Hellweg; Martin Dietzel; Grizelda Kersteen
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Comparative stochastic process variation bands for N7, N5, and N3 at EUV
Author(s): Alessandro Vaglio Pret; Trey Graves; David Blankenship; Kunlun Bai; Stewart Robertson; Peter De Bisschop; John J. Biafore
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Single exposure EUV of 32nm pitch logic structures: patterning performance on BF and DF masks
Author(s): V. M. Blanco Carballo; J. Bekaert; J. H. Franke; R. H. Kim; E. Hendrickx; L. E. Tan; W. Gillijns; Y. Drissi; M. Mao; G. McIntyre; M. Dusa; M. Kupers; D. Rio; G. Schiffelers; E. De Poortere; J. Jia; S. Hsu; M. Demand; K. Nafus; S. Biesemans
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DDR process and materials for novel tone reverse technique
Author(s): Shuhei Shigaki; Wataru Shibayama; Satoshi Takeda; Mamoru Tamura; Makoto Nakajima; Rikimaru Sakamoto
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SRAF requirements, relevance, and impact on EUV lithography for next-generation beyond 7nm node
Author(s): Vivian Wei Guo; Fan Jiang; Alexander Tritchkov; Srividya Jayaram; Scott Mansfield; Larry Zhuang; Yuyang Sun; Xima Zhang; Todd Bailey
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Double patterning at NA 0.33 versus high-NA single exposure in EUV lithography: an imaging comparison
Author(s): Weimin Gao; Vincent Wiaux; Wolfgang Hoppe; Vicky Philipsen; Lawrence S. Melvin III; Eric Hendrickx; Kevin Lucas; Ryoung-han Kim
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Model based high NA anamorphic EUV RET
Author(s): Fan Jiang; Vincent Wiaux; Germain Fenger; Chris Clifford; Vlad Liubich; Eric Hendrickx
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Impact of aberrations in EUV lithography: metal to via edge placement control
Author(s): Lianghong Yin; Ananthan Raghunathan; Germain Fenger; Shumay Shang; Neal Lafferty; John Sturtevant
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The future of EUV lithography: continuing Moore's Law into the next decade
Author(s): Jan van Schoot; Kars Troost; Frank Bornebroek; Rob van Ballegoij; Sjoerd Lok; Peter Krabbendam; Judon Stoeldraijer; Jos Benschop; Jo Finders; Hans Meiling; Eelco van Setten; Bernhard Kneer; Peter Kuerz; Winfried Kaiser; Tilmann Heil; Sascha Migura
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Diffuser concepts for in-situ wavefront measurements of EUV projection optics
Author(s): Mark van de Kerkhof; Robbert Jan Voogd; Ad Schasfoort; Evert Westerhuis; Wouter Engelen; Manfred Dikkers; Yassin Chowdhury; Michael Kriese; Stefan Bäumer; Uwe Zeitner; Torsten Feigl
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Speckle metrology for extreme ultra-violet lithography
Author(s): A. Shanker; L. Waller; G. Gunjala; A. Wojdyla; D. Voronov; P. Naulleau
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Electrical comparison of iN7 EUV hybrid and EUV single patterning BEOL metal layers
Author(s): Stéphane Larivière; Christopher J. Wilson; Bogumila Kutrzeba Kotowska; Janko Versluijs; Stefan Decoster; Ming Mao; Marleen H. van der Veen; Nicolas Jourdan; Zaid El-Mekki; Nancy Heylen; Els Kesters; Patrick Verdonck; Christophe Béral; Dieter Van den Heuvel; Peter De Bisschop; Joost Bekaert; Victor Blanco; Ivan Ciofi; Danny Wan; Basoene Briggs; Arindam Mallik; Eric Hendrickx; Ryoung-han Kim; Greg McIntyre; Kurt Ronse; Jürgen Bömmels; Zsolt Tőkei; Dan Mocuta
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Inorganic hardmask development for EUV patterning
Author(s): Anuja De Silva; Ashim Dutta; Luciana Meli; Yiping Yao; Yann Mignot; Jing Guo; Nelson M. Felix
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Self-aligned block and fully self-aligned via for iN5 metal 2 self-aligned quadruple patterning
Author(s): Benjamin Vincent; Joern-Holger Franke; Aurelie Juncker; Frederic Lazzarino; Gayle Murdoch; Sandip Halder; Joseph Ervin
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EUV contact-hole local CD uniformity optimization for DRAM storage node application
Author(s): Mijung Lim; Chang-Moon Lim; Chang-Nam Ahn; Daniel Park; Anita Fumar-Pici; Nak Seong
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Illumination source optimization in EUV lithography for staggered contact holes and pillars for DRAM applications
Author(s): Jo Finders; Ziyang Wang; John McNamara; Gijsbert Rispens; Pär Broman; Chang-Nam Ahn; Inhwan Lee; Hwan Kim; Junghyun Kang; Yoonsuk Hyun; Chang-Moon Lim
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A comparison of different methods of characterizing EUV photoresist shrinkage
Author(s): Ramya Viswanathan; Scott Mansfield; Wenxin Li; Shuhai Fan; Roger Cornell; Hongxin Zhang
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EUV mask lifetime testing using EBL2
Author(s): Chien-Ching Wu; Edwin te Sligte; Herman Bekman; Arnold J. Storm; Michel van Putten; Maurice P.M. A. Limpens; Jacqueline van Veldhoven; Alex Deutz
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Aerial image based metrology of EUV masks: recent achievements, status, and outlook for the AIMS EUV platform
Author(s): Renzo Capelli; Dirk Hellweg; Martin Dietzel; Markus Koch; Conrad Wolke; Grizelda Kersteen
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Attenuated PSM for EUV: Can they mitigate 3D mask effects?
Author(s): Andreas Erdmann; Peter Evanschitzky; Hazem Mesilhy; Vicky Philipsen; Eric Hendrickx; Markus Bauer
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EUVL back-insertion layout optimization
Author(s): D. Civay; E. Laffosse; A. Chesneau
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Impact of EUV mask absorber sidewall angle on patterning robustness
Author(s): Lawrence S. Melvin III; Yudhishthir Kandel; Tim Fühner; Weimin Gao
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Shot noise: A 100 year history, with applications to lithography
Author(s): Chris A. Mack
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High-power LPP-EUV source with long collector mirror lifetime for high volume semiconductor manufacturing
Author(s): Hakaru Mizoguchi; Hiroaki Nakarai; Tamatsu Abe; Krzysztof M. Nowak; Yasufumi Kawasuji; Hiroshi Tanaka; Yukio Watanabe; Tsukasa Hori; Takeshi Kodama; Yutaka Shiraishi; Tatsuya Yanagida; George Soumangne; Tsuyoshi Yamada; Taku Yamazaki; Takashi Saitou
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Increasing EUV source efficiency via recycling of radiation power
Author(s): Ahmed Hassanein; Valeryi Sizyuk; Tatyana Sizyuk; Kenneth C. Johnson
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Study of Sn removal by surface wave plasma for source cleaning (Conference Presentation)
Author(s): Gianluca A. Panici; Dren Qerimi; David N. Ruzic
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Modeling of emission of particle debris from ablation of the tin target for the laser produced plasma extreme ultra-violet light source (Conference Presentation)
Author(s): Akira Sasaki
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A tabletop coherent EUV source for commercial EUVL metrology and imaging applications
Author(s): Xiaoshi Zhang; Jon Garlick; Eric Mountfort; Henry Kapteyn
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Effects of chamber conditions on EUV source efficiency and optical system performance during high-frequency operation
Author(s): Tatyana Sizyuk; John Oliver; Weirong Yuan
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CNTs in the context of EUV pellicle history
Author(s): Emily Gallagher; Marina Y. Timmermans; Ivan Pollentier; Jae Uk Lee; Marina Mariano; Christoph Adelmann; Cedric Huyghebaert; Frank Scholze; Christian Laubis
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Printability estimation of EUV blank defect using actinic image
Author(s): Takeshi Yamane; Takashi Kamo; Rik Jonckheere
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Actinic EUV scatterometry for parametric mask quantification
Author(s): Stuart Sherwin; Andrew Neureuther; Patrick Naulleau
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A comparative study of EUV absorber materials using lensless actinic imaging of EUV photomasks
Author(s): S. Fernandez; D. Kazazis; R. Rajeev; I. Mochi; P. Helfenstein; S. Yoshitake; Y. Ekinci
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Through-pellicle inspection of EUV masks
Author(s): Iacopo Mochi; Rajendran Rajeev; Patrick Helfenstein; Sara Fernandez; Dimitrios Kazazis; Yasin Ekinci
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Population statistics of EUV printed MOx resist features (Conference Presentation)
Author(s): Peter de Schepper; Jason K. Stowers; Michael Greer; Craig Needham; Stephen Meyers; Michael Kocsis; Andrew Grenville
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Stochastic effects in EUV lithography
Author(s): P. De Bisschop; E. Hendrickx
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High-resolution EUV lithography using a multi-trigger resist
Author(s): C. Popescu; D. Kazazis; A. McClelland; G. Dawson; J. Roth; W. Theis; Y. Ekinci; A. P. G. Robinson
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Constructing a robust PSCAR process for EUV
Author(s): Michael Carcasi; Seiji Nagahara; Gosuke Shiraishi; Yukie Minekawa; Hiroyuki Ide; Yoshihiro Kondo; Kosuke Yoshihara; Masaru Tomono; Ryo Shimada; Kazuhiro Takeshita; Teruhiko Moriya; Yuya Kamei; Kathleen Nafus; Serge Biesemans; Hideo Nakashima; Masafumi Hori; Ken Maruyama; Hisashi Nakagawa; Tomoki Nagai; Satoshi Dei; Masayuki Miyake; Takehiko Naruoka; Motoyuki Shima; Geert Vandenberghe; Danilo De Simone; Philippe Foubert; John S. Petersen; Akihiro Oshima; Seiichi Tagawa
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Systematic assessment of the contributors of line edge roughness in EUV lithography using simulations
Author(s): Anindarupa Chunder; Azat Latypov; John J. Biafore; Harry J. Levinson; Todd Bailey
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Sensitization and reaction mechanisms of ZrO2 nanoparticle resist used for extreme-ultraviolet lithography (Conference Presentation)
Author(s): Takahiro Kozawa; Satoshi Ishihara; Hiroki Yamamoto; Julius Joseph Santillan; Toshiro Itani
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EUV metal oxide hybrid photoresists: ultra-small structures for high-resolution patterning
Author(s): Hong Xu; Kou Yang; Kazunori Sakai; Vasiliki Kosma; Kazuki Kasahara; Emmanuel P. Giannelis; Christopher K. Ober
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Evaluation of high-resolution and sensitivity of n-CAR hybrid resist for sub-16nm or below technology node
Author(s): Satinder K. Sharma; Mohamad Ghulam Moinuddin; Pulikanti Guruprasad Reddy; Chullikkattil P. Pradeep; Subrata Ghosh; Kenneth E. Gonsalves
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Ultra-sensitive EUV resists based on acid-catalyzed polymer backbone breaking
Author(s): Theodoros Manouras; Dimitrios Kazazis; Eleftherios Koufakis; Yasin Ekinci; Maria Vamvakaki; Panagiotis Argitis
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Extreme ultraviolet mask multilayer material variation impact on horizontal to vertical pattern bias
Author(s): Lawrence S. Melvin; Yudhishthir Kandel; Qiliang Yan; Artak Isoyan; Weimin Gao
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Low-stress and high-reflectance Mo/Si multilayers for EUVL by magnetron sputtering deposition with bias assistance
Author(s): Bo Yu; Liping Wang; Hailiang Li; Yao Xie; Hui Wang; Haitao Zhang; Shun Yao; Yu Liu; Jie Yu; Chun Li; Changqing Xie; Chunshui Jin
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Patterning mechanism of metal based hybrid EUV resists
Author(s): Vasiliki Kosma; Kazuki Kasahara; Hong Xu; Kazunori Sakai; Christopher K. Ober; Emmanuel P. Giannelis
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Resist coating and developing process technology toward EUV manufacturing sub-7nm node
Author(s): Yuya Kamei; Takahiro Shiozawa; Shinichiro Kawakami; Hideo Shite; Hiroshi Ichinomiya; Yusaku Hashimoto; Masashi Enomoto; Kathleen Nafus; Akihiro Sonoda; Marc Demand; Philippe Foubert
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Chemically amplified EUV resists approaching 11nm half-pitch
Author(s): Zuhal Tasdemir; Michaela Vockenhuber ; Iacopo Mochi; Karen Garrido Olvera; Marieke Meeuwissen; Oktay Yildirim; Rik Hoefnagels; Gijsbert Rispens; Rolf Custers; Yasin Ekinci
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Exploring EUV and SAQP pattering schemes at 5nm technology node
Author(s): Ahmed Hamed Fatehy; Rehab Kotb; Neal Lafferty; Fan Jiang; James Word
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A study on enhancing EUV resist sensitivity (2)
Author(s): Atsushi Sekiguchi; Yoko Matsumoto; Mariko Isono; Michiya Naito; Yoshiyuki Utsumi; Tetsuo Harada; Takeo Watanabe
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Ultimate patterning limits for EUV at 5nm node and beyond
Author(s): Rehab Kotb Ali; Ahmed Hamed Fatehy; Neal Lafferty; James Word
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Thermomechanical changes of EUV mask and absorber dependency
Author(s): Chung-Hyun Ban; Sung-Gyu Lee; Eun-Sang Park; Jae-Hun Park; Hye-Keun Oh
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Theoretical modeling of PEB procedure on EUV resist using FDM formulation
Author(s): Muyoung Kim; Junghwan Moon; Joonmyung Choi; Byunghoon Lee; Changyoung Jeong; Heebom Kim; Maenghyo Cho
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EUVL Gen 2.0: key requirements for constraining semiconductor cost in advanced technology node manufacturing
Author(s): Arindam Mallik; Peter Debacker; Greg McIntyre; Ryoung-Han Kim; Kurt Ronse
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Industrialization of a robust EUV source for high-volume manufacturing and power scaling beyond 250W
Author(s): Michael Purvis; Igor V. Fomenkov; Alexander A. Schafgans; Mike Vargas; Spencer Rich; Yezheng Tao; Slava I. Rokitski; Melchior Mulder; Erik Buurman; Michael Kats; Jayson Stewart; Andrew D. LaForge; Chirag Rajyaguru; Georgiy Vaschenko; Alex I. Ershov; Robert J. Rafac; Mathew Abraham; David C. Brandt; Daniel J. Brown
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Key components development progress updates of the 250W high-power LPP-EUV light source
Author(s): Yoshifumi Ueno; Tsukasa Hori; Yasufumi Kawasuji; Yutaka Shiraishi; Tatsuya Yanagida; Kenichi Miyao; Hideyuki Hayashi; Takuya Ishii; Yukio Watanabe; Takeshi Okamoto; Tamotsu Abe; Takeshi Kodama; Hiroaki Nakarai; Taku Yamazaki; Noritoshi Itou; Takashi Saitou; Hakaru Mizoguchi
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