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Heterogeneous Integration: Systems on a Chip: A Critical Review
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Volume Details

Volume Number: 10292
Date Published: 27 January 1998
: 0 papers () pages

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Front Matter: Volume 10292
Author(s): Proceedings of SPIE
Large-scale monolithic integration technologies for InP-based transmitters and receivers
Author(s): K. J. Thomson; Pavel Studenkov; J. Christopher Dries; M. R. Gokhale; Dong-Su Kim; Song Yu; Stephen R. Forrest; Michael J. Lange; E. Mykietyn; Gregory H. Olsen
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Fusion bonding: hetero-interfacial materials analysis and device application
Author(s): K. A. Black; Aaron R. Hawkins; Near M. Margalit; Dubravko I. Babic; Archie L. Holmes; Ying-Lan Chang; P. Abraham; John Edward Bowers; Evelyn L. Hu
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Compliant substrate technology for heterogeneous integration
Author(s): Yu-Hwa Lo; Zuhua Zhu; Rong Zhou; J. Zhang; Daryl J. Dagel; L. N. Srivasta; Y. Zhou; David Thomas Crouse
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Dense two-dimensional integration of optoelectronics and electronics for interconnections
Author(s): David A. B. Miller
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DNA-assisted microassembly: a hetrogeneous integration technology for optoelectronics
Author(s): Sadik C. Esener; Daniel M. Hartmann; Michael J. Heller; Jeffrey M. Cable
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Native oxide technology for III-V optoelectronic devices
Author(s): Dennis G. Deppe; Diana L. Huffaker
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VCSEL-based smart pixels and their applications
Author(s): Tatsushi Nakahara; H. Tsuda; Shinji Matsuo; Takashi Kurokawa
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VCSEL-based optoelectronic smart pixels
Author(s): Mary K. Hibbs-Brenner; Yue Liu; Robert A. Morgan; John A. Lehman
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Status of optoelectronic-VLSI technology based on electroabsorption modulators
Author(s): Ashok V. Krishnamoorthy; Keith W. Goossen
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Integration of AlGaAs devices
Author(s): David L. Mathine
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