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64-to 256-Megabit Reticle Generation: Technology Requirements and Approaches: A Critical Review
Editor(s): Gregory K. Hearn

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Volume Details

Volume Number: 10273
Date Published: 1 January 1994

Table of Contents
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Front Matter: Volume 10273
Author(s): Proceedings of SPIE
Lithography Roadmap: the role of the mask-making industry
Author(s): Gordon B. McMillan
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Circuit design: emphasis on mask design and specification
Author(s): Hoyoung Kang; Chang-Jin Sohn; Woo-Sung Han; Young-Bum Koh; Moon-Yong Lee
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Lithography error budget
Author(s): John Canning; Gilbert V. Shelden
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Wafer steppers for the 64-M and 256-Mbit memory generations
Author(s): William H. Arnold; Gary C. Escher
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Process engineering: overview of wafer fab process engineering dealing with equipment, processes, and control techniques to meet the SIA road map
Author(s): Nigel R. Farrar
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Reticle variation influence on manufacturing line and wafer device performance
Author(s): John L. Nistler; Kyle Spurlock
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E-beam and optical reticle generation
Author(s): C. Neil Berglund
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Reticle processing: overview of current and future reticle processing systems and system improvements that will enable the reticle manufacturer to meet future needs
Author(s): Kathy S. Milner
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Reticle metrology requirements: systems and methods
Author(s): Scott Landstrom; Bert F. Plambeck
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Reticle defect detection and repair
Author(s): Rajeev R. Singh
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Cleaning and pelliclization
Author(s): Susan V. Daugherty
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Mask quality assurance from a user's perspective
Author(s): Terry W. Russell
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Technology development in the U.S. and Japan: the case of the phase-shifting mask
Author(s): Frank Schellenberg; Dan Okimoto; Jim Raphael; Norihiko Shirouzu
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