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PROCEEDINGS VOLUME 10144

Emerging Patterning Technologies
Editor(s): Christopher Bencher
Format Member Price Non-Member Price
Softcover $67.50 $90.00

Volume Details

Volume Number: 10144
Date Published: 4 May 2017
Softcover: 20 papers (172) pages
ISBN: 9781510607392

Table of Contents
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Materials innovation: It's no longer only about resolution
Author(s): Nobu Koshiba
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Front Matter: Volume 10144
Author(s):
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Nanoimprint system development for high-volume semiconductor manufacturing the and status of overlay performance
Author(s): Yukio Takabayashi; Mitsuru Hiura; Hiroshi Morohoshi; Nobuhiro Kodachi; Tatsuya Hayashi; Atsushi Kimura; Takahiro Yoshida; Kazuhiko Mishima; Yoshio Suzaki; Jin Choi
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Study of nanoimprint lithography (NIL) for HVM of memory devices
Author(s): Takuya Kono; Masayuki Hatano; Hiroshi Tokue; Kei Kobayashi; Masato Suzuki; Kazuya Fukuhara; Masafumi Asano; Tetsuro Nakasugi; Eun Hyuk Choi; Wooyung Jung
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Improved defectivity and particle control for nanoimprint lithography high-volume semiconductor manufacturing
Author(s): Takahiro Nakayama; Masami Yonekawa; Yoichi Matsuoka; Hisanobu Azuma; Yukio Takabayashi; Ali Aghili; Makoto Mizuno; Jin Choi; Chris E. Jones
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High throughput nanoimprint lithography for semiconductor memory applications
Author(s): Zhengmao Ye; Wei Zhang; Niyaz Khusnatdinov; Tim Stachowiak; J. W. Irving; Whitney Longsine; Matthew Traub; Brian Fletcher; Weijun Liu
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Overlay control for nanoimprint lithography
Author(s): Kazuya Fukuhara; Masato Suzuki; Masaki Mitsuyasu; Takuya Kono; Tetsuro Nakasugi; Yonghyun Lim; Wooyung Jung
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Selective surface smoothening of 3D micro-optical elements
Author(s): Helmut Schift; Nachiappan Chidambaram; Mirco Altana; Robert Kirchner
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New 3D structuring process for non-integrated circuit related technologies (Conference Presentation)
Author(s): Lamia Nouri; Nicolas Possémé; Stéfan Landis; Frédéric Milesi; Frédéric-Xavier Gaillard
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Development of nanoimprint lithography templates for the contact hole layer application (Conference Presentation)
Author(s): Koji Ichimura; Ryugo Hikichi; Saburo Harada; Koichi Kanno; Masaaki Kurihara; Naoya Hayashi
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Overview and development of EDA tools for integration of DSA into patterning solutions
Author(s): J. Andres Torres; Germain Fenger; Daman Khaira; Yuansheng Ma; Yuri Granik; Chris Kapral; Joydeep Mitra; Polina Krasnova; Dehia Ait-Ferhat
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Free energy modeling of block-copolymer within pillar confinements on DSA lithography
Author(s): Seokhan Park; Joonsoo Park; Jemin Park; Hyun-Woo Kim; Changhyun Cho; Hyeongsun Hong; Kyupil Lee; ES Jung
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Process, design rule, and layout co-optimization for DSA based patterning of sub-10nm Finfet devices
Author(s): Joydeep Mitra; Andres Torres; David Z. Pan
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Advanced fast 3D DSA model development and calibration for design technology co-optimization
Author(s): Kafai Lai; Balint Meliorisz; Thomas Muelders; Ulrich Welling; Hans-Jürgen Stock; Sajan Marokkey; Wolfgang Demmerle; Chi-Chun Liu; Cheng Chi; Jing Guo
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Progress on complementary patterning using plasmon-excited electron beamlets (Conference Presentation)
Author(s): Zhidong Du; Chen Chen; Liang Pan
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Simulation analysis of a miniaturized electron optics of the massively parallel electron-beam direct-write (MPEBDW) for multi-column system
Author(s): Akira Kojima; Naokatsu Ikegami; Hiroshi Miyaguchi; Takashi Yoshida; Ryutaro Suda; Shinya Yoshida; Masanori Muroyama; Kentaro Totsu; Masayoshi Esashi; Nobuyoshi Koshida
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Overlay performance assessment of MAPPER's FLX-1200 (Conference Presentation)
Author(s): Ludovic Lattard; Isabelle Servin; Jonathan Pradelles; Yoann Blancquaert; Guido Rademaker; Laurent Pain; Guido de Boer; Pieter Brandt; Michel Dansberg; Remco J. A. Jager; Jerry J. M. Peijster; Erwin Slot; Stijn W. H. K. Steenbrink; Niels Vergeer; Marco Wieland
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Advanced surface affinity control for DSA contact hole shrink applications
Author(s): Florian Delachat; Ahmed Gharbi; Patricia Pimenta Barros; Maxime Argoud; Céline Lapeyre; Sandra Bos; Jérôme Hazart; Laurent Pain; Cédric Monget; Xavier Chevalier; Célia Nicolet; Christophe Navarro; Ian Cayrefourcq; Raluca Tiron
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Pattern defect reduction and LER improvement of chemo-epitaxy DSA process
Author(s): Makoto Muramatsu; Takanori Nishi; Gen You; Yusuke Saito; Yasuyuki Ido; Noriaki Oikawa; Toshikatsu Tobana; Kiyohito Ito; Shinya Morikita; Takahiro Kitano
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Wide-range directed self-assembly lithography enabling wider range of applicable pattern size for both hexagonal multi-hole and line/space
Author(s): Seiji Morita; Ryuichi Saito; Ryosuke Yamamoto; Norikatsu Sasao; Tomoaki Sawabe; Koji Asakawa; Shinobu Sugimura
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Rules-based correction strategies setup on sub-micrometer line and space patterns for 200mm wafer scale SmartNIL process within an integration process flow
Author(s): H. Teyssedre; S. Landis; P. Brianceau; M. Mayr; C. Thanner; M. Laure; W. Zorbach; M. Eibelhuber; L. Pain; M. Chouiki; M. Wimplinger
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RLT uniformity improvement utilizing multi-scale NIL process simulation
Author(s): Sachiko Kobayashi; Ryoichi Inanami; Hirotaka Tsuda; Kazuhiro Washida; Motofumi Komori; Kyoji Yamashita; Ji-Young Im; Takuya Kono; Shimon Maeda
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Latest evolution in a 300mm graphoepitaxy pilot line flow for L/S applications
Author(s): G. Claveau; M. Argoud; P. Pimenta-Barros; G. Chamiot-Maitral; R. Tiron; X. Chevalier; C. Navarro
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The opportunity and challenge of spin coat based nanoimprint lithography
Author(s): Wooyung Jung; Jungbin Cho; Eunhyuk Choi; Yonghyun Lim; Cheolkyu Bok; Masatoshi Tsuji; Kei Kobayashi; Takuya Kono; Tetsuro Nakasugi
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Inspection and fabrication of nano-imprint stamp using electron and ion dual beam system
Author(s): Yung-Chiang Ting; Shyi-Long Shy
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Model-based guiding pattern synthesis for on-target and robust assembly of via and contact layers using DSA
Author(s): Joydeep Mitra; Andres Torres; Yuansheng Ma; David Z. Pan
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