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Technical Issues in Focal Plane Development
Editor(s): William S. Chan; Esther Krikorian
Format Member Price Non-Member Price
Softcover $105.00 * $105.00 *

*Available as a black-and-white photocopy reprint only. Allow two weeks reprinting time plus standard delivery time. No discounts or returns apply.

Volume Details

Volume Number: 0282
Date Published: 29 December 1981
Softcover: 16 papers (136) pages
ISBN: 9780892523153

Table of Contents
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Design Requirements For Large-Scale Focal Planes
Author(s): M. Schlessinger; W. S. Chan
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Development Of Teal Ruby Experiment Radiometric Test Requirements
Author(s): W. B. Birtley; O. K. Kowallis; L. A. Molnar; T. J. Wright
Show Abstract
Conceptual Design And Requirements Of A Pushbroom Focal Plane
Author(s): Wayne K. Davis
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Teal Amber Visible Focal Plane Technology
Author(s): Charles R. Johnson; Ron Burczewski
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Shutterless Fixed Pattern Noise Correction For Infrared Imaging Arrays
Author(s): P. M. Narendra; N. A. Foss
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Signal Conditioning For Infrared Staring Arrays
Author(s): Richard W. Helfrich
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Source-Coupling For Hybrid Focal Planes
Author(s): K. Chow; J. D. Blackwell; J. P. Rode; D. H. Sieb; W. N. Lin
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Development Of A Three-Dimensional Circuit Integration Technology And Computer Architecture
Author(s): R. D. Etchells; J. Grinberg; G. R. Nudd
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Compensation Electronics For Staring Focal Plane Arrays
Author(s): K. Hartnett; C. Marshall; N. Butler
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Technical Issues In Focal Plane Development For Terrestrial Resource Observations
Author(s): Leslie L. Thompson
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Large Time-Delay-And-Integration (TDI) Arrays And Focal Plane Structures With Intrinsic Silicon Response
Author(s): R. H. Dyck; H. Sadowski
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Epitaxial HgCdTe/CdTe Photodiodes For The 1 To 3 μm Spectral Region
Author(s): J. G. Pasko; S. H. Shin; D. T. Cheung
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Signal Processing For Large Focal Plane Arrays
Author(s): Richard J. Jones; David C. Smith
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1.0 to 2.5 Micrometer Short Wavelength Infrared (SWIR) Linear Array Technology For Low Background Applications
Author(s): J. Stobie; S. Iwasa
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Properties Of Passivant Films On HgCdTe - Interaction With The Substrate
Author(s): G. D. Davis; T. S. Sun; S. P. Buchner; N. E. Byer
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Signal Processing For Time Delay And Integrating Charge-Coupled Device (TDI-CCD) In The Panoramic Scan Mode
Author(s): Henry Sadowski
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