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Proceedings Paper

Photonics Manufacturing and Automation Forum
Author(s): Linda L. DeHainaut; William J. Gunning; Kevin L. Pettijohn; Ken McGhee; Daniel Chen; John Stafford; Satoshi Ishihara; Dieter Bergman; Daniel G. Nelson; David Sherrer; Peter M. Herman; William L. Emkey
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Paper Details

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Proc. SPIE 4652, Optoelectronic Interconnects, Integrated Circuits, and Packaging, ; doi: 10.1117/12.998962
Show Author Affiliations
Linda L. DeHainaut, Air Force Research Lab. (United States)
William J. Gunning, Rockwell Scientific Corp. (United States)
Kevin L. Pettijohn, Raytheon Infrared Operations (United States)
Ken McGhee, JEDEC (United States)
Daniel Chen, Mitsubishi Corp. (United States)
John Stafford, NEMI Technical Eoarking Group on Optoelectronics (United States)
Satoshi Ishihara, Optoelectronic Industry & Technology Dev. Assoc. (Japan)
Dieter Bergman, IPC (United States)
Daniel G. Nelson, JDS Uniphase (United States)
David Sherrer, Haleos (United States)
Peter M. Herman, Pemstar Corp. (United States)
William L. Emkey, kSaria (United States)


Published in SPIE Proceedings Vol. 4652:
Optoelectronic Interconnects, Integrated Circuits, and Packaging
Louay A. Eldada; Randy A. Heyler; John R. Rowlette; John R. Rowlette; Randy A. Heyler, Editor(s)

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