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Proceedings Paper

Optimization of the SOI wafer flow process for ion projection lithography (IPL) stencil mask making
Author(s): Joerg Butschke; Bernd Hoefflinger; Mathias Irmscher; Florian Letzkus; Christian Reuter; Reinhard Springer; Albrecht Ehrmann; Karl Kragler; Thomas Struck
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Paper Details

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Proc. SPIE 3997, Emerging Lithographic Technologies IV, ; doi: 10.1117/12.998889
Show Author Affiliations
Joerg Butschke, Institut fuer Mikroelektronik Chips (Germany)
Bernd Hoefflinger, Institut fuer Mikroelektronik Chips (Germany)
Mathias Irmscher, Institut fuer Mikroelektronik Chips (Germany)
Florian Letzkus, Institut fuer Mikroelektronik Chips (Germany)
Christian Reuter, Institut fuer Mikroelektronik Chips (Germany)
Reinhard Springer, Institut fuer Mikroelektronik Chips (Germany)
Albrecht Ehrmann, Infineon Technologies AG (Germany)
Karl Kragler, Infineon Technologies AG (Germany)
Thomas Struck, Infineon Technologies AG (Germany)


Published in SPIE Proceedings Vol. 3997:
Emerging Lithographic Technologies IV
Elizabeth A. Dobisz, Editor(s)

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