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Characterization of CMP scratches using light scattering techniques
Author(s): Po-Fu Huang; Yuri S. Uritsky
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Proc. SPIE 3884, In-Line Methods and Monitors for Process and Yield Improvement, ; doi: 10.1117/12.997779
Show Author Affiliations
Po-Fu Huang, Applied Materials, Inc. (United States)
Yuri S. Uritsky, Applied Materials, Inc. (United States)


Published in SPIE Proceedings Vol. 3884:
In-Line Methods and Monitors for Process and Yield Improvement
Sergio A. Ajuria; Jerome F. Jakubczak, Editor(s)

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