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Proceedings Paper

Integration of copper interconnects to 0.20 um CMOS technology
Author(s): Rabiul Islam; Brad Smith; Suresh Venkatesan; Stanley M. Filipiak; Kevin D. Lucas; Janos Farkas; Phil Crabtree; Tab Stephens
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Paper Details

Date Published:
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Proc. SPIE 3883, Multilevel Interconnect Technology III, ; doi: 10.1117/12.997769
Show Author Affiliations
Rabiul Islam, Motorola (United States)
Brad Smith, Motorola (United States)
Suresh Venkatesan, Motorola (United States)
Stanley M. Filipiak, Motorola (United States)
Kevin D. Lucas, Motorola (Belgium)
Janos Farkas, Motorola (United States)
Phil Crabtree, Motorola (United States)
Tab Stephens, Motorola (United States)


Published in SPIE Proceedings Vol. 3883:
Multilevel Interconnect Technology III
Mart Graef; Divyesh N. Patel, Editor(s)

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