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Proceedings Paper

Low-k polymer etch development for dual damascene applications
Author(s): Yan Ye; Peter Yehkai Hsieh; Allen Zhao; Hui Chen; Peter Chen; Diana Ma
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Proc. SPIE 3883, Multilevel Interconnect Technology III, ; doi: 10.1117/12.997767
Show Author Affiliations
Yan Ye, Applied Materials, Inc. (United States)
Peter Yehkai Hsieh, Applied Materials, Inc. (United States)
Allen Zhao, Applied Materials, Inc. (United States)
Hui Chen, Applied Materials, Inc. (United States)
Peter Chen, Applied Materials, Inc. (United States)
Diana Ma, Applied Materials, Inc. (United States)


Published in SPIE Proceedings Vol. 3883:
Multilevel Interconnect Technology III
Mart Graef; Divyesh N. Patel, Editor(s)

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