Share Email Print
cover

Proceedings Paper

Optical interconnects for board and backplane applications
Author(s): Yung-Sheng Liu
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Details

Date Published:
PDF
Proc. SPIE 3714, Enabling Photonic Technologies for Aerospace Applications, ; doi: 10.1117/12.996365
Show Author Affiliations
Yung-Sheng Liu, Industrial Technology Research Institute (Taiwan)


Published in SPIE Proceedings Vol. 3714:
Enabling Photonic Technologies for Aerospace Applications
Andrew R. Pirich; Edward W. Taylor, Editor(s)

© SPIE. Terms of Use
Back to Top