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Proceedings Paper

Rapid nondestructive automated quantification of nanometer-level deviations from wafer site flatness
Author(s): Lionel Kuhlmann; Henrik Nielsen; Mark A. Nokes
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Paper Details

Date Published:
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Proc. SPIE 3677, Metrology, Inspection, and Process Control for Microlithography XIII, ; doi: 10.1117/12.996104
Show Author Affiliations
Lionel Kuhlmann, KLA-Tencor Corp. (United States)
Henrik Nielsen, KLA-Tencor Corp. (United States)
Mark A. Nokes, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 3677:
Metrology, Inspection, and Process Control for Microlithography XIII
Bhanwar Singh, Editor(s)

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