Share Email Print

Proceedings Paper

Effect of Sn incorporation, process anneal and barrier substrates on the chemical mechanical polishing of sputtered copper films
Author(s): Johnson O. Olowolafe; Sarbajit Datta; Guohua Qiu; Daniel W. van der Weide; Anantha Sethuraman; Lee M. Cook; Ashwani Rawat
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Details

Date Published:
Proc. SPIE 3214, Multilevel Interconnect Technology, ; doi: 10.1117/12.992221
Show Author Affiliations
Johnson O. Olowolafe, Univ. of Delaware (United States)
Sarbajit Datta, Univ. of Delaware (United States)
Guohua Qiu, Univ. of Delaware (United States)
Daniel W. van der Weide, Univ. of Delaware (United States)
Anantha Sethuraman, Rodel Inc. (United States)
Lee M. Cook, Rodel Inc. (United States)
Ashwani Rawat, Rodel Inc. (United States)

Published in SPIE Proceedings Vol. 3214:
Multilevel Interconnect Technology
Divyesh N. Patel; Mart Graef, Editor(s)

© SPIE. Terms of Use
Back to Top