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Proceedings Paper

Experience with bonding silicon by soldering
Author(s): Andreas K. Freund
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Paper Details

Date Published:
Proc. SPIE 2855, High Heat Flux Engineering III, ; doi: 10.1117/12.989903
Show Author Affiliations
Andreas K. Freund, Stanford Univ. and European Synchrotron Radiation Facility (France) (France)

Published in SPIE Proceedings Vol. 2855:
High Heat Flux Engineering III
Ali M. Khounsary, Editor(s)

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