Share Email Print

Proceedings Paper

Comparison study of thermal induced strain in anodically bonded HOYA glass to silicon and Pyrex to silicon
Author(s): K. Sooriakumar; Ken Goldman; Greg Vanhoy
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Details

Date Published:
Proc. SPIE 2639, Micromachining and Microfabrication Process Technology, ; doi: 10.1117/12.988326
Show Author Affiliations
K. Sooriakumar, Motorola (United States)
Ken Goldman, Motorola (United States)
Greg Vanhoy, Motorola (United States)

Published in SPIE Proceedings Vol. 2639:
Micromachining and Microfabrication Process Technology
Karen W. Markus, Editor(s)

© SPIE. Terms of Use
Back to Top