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Proceedings Paper

Comparison study of thermal induced strain in anodically bonded HOYA glass to silicon and Pyrex to silicon
Author(s): K. Sooriakumar; Ken Goldman; Greg Vanhoy
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Date Published:
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Proc. SPIE 2639, Micromachining and Microfabrication Process Technology, ; doi: 10.1117/12.988326
Show Author Affiliations
K. Sooriakumar, Motorola (United States)
Ken Goldman, Motorola (United States)
Greg Vanhoy, Motorola (United States)


Published in SPIE Proceedings Vol. 2639:
Micromachining and Microfabrication Process Technology
Karen W. Markus, Editor(s)

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