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Proceedings Paper

MeV-clustered BILLI implantation for twin- and triple-well CMOS process simplification, improved GOI, and latch-up free performance
Author(s): John O. Borland
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Paper Details

Date Published:
Proc. SPIE 2335, Microelectronics Technology and Process Integration, ; doi: 10.1117/12.986315
Show Author Affiliations
John O. Borland, Genus, Inc. (United States)

Published in SPIE Proceedings Vol. 2335:
Microelectronics Technology and Process Integration
Fusen E. Chen; Shyam P. Murarka, Editor(s)

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