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Proceedings Paper

Study of TiN/AlSiCu/TiN/Ti interconnect etching in a high-pressure magnetically enhanced RIE reactor
Author(s): Yu-Chung Tien; W. H. Lee; R. Huang; Han-Wen Chang; May Ho; Jean Wang
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Proc. SPIE 2334, Microelectronics Manufacturability, Yield, and Reliability, ; doi: 10.1117/12.986307
Show Author Affiliations
Yu-Chung Tien, Winbond Electronics Corp. (Taiwan)
W. H. Lee, Winbond Electronics Corp. (Taiwan)
R. Huang, Winbond Electronics Corp. (Taiwan)
Han-Wen Chang, Applied Material Taiwan (Taiwan)
May Ho, Applied Material Taiwan (Taiwan)
Jean Wang, Applied Material Taiwan (Taiwan)


Published in SPIE Proceedings Vol. 2334:
Microelectronics Manufacturability, Yield, and Reliability
Barbara Vasquez; Hisao Kawasaki, Editor(s)

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