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Proceedings Paper

Wafer-level micro-optics: trends in manufacturing, testing, packaging and applications
Author(s): Reinhard Voelkel; Li Gong; Juergen Rieck; Alan Zheng
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Paper Abstract

Micro-optics is an indispensable key enabling technology (KET) for many products and applications today. Probably the most prestigious examples are the diffractive light shaping elements used in high-end DUV lithography steppers. Highly efficient refractive and diffractive micro-optical elements are used for precise beam and pupil shaping. Micro-optics had a major impact on the reduction of aberrations and diffraction effects in projection lithography, allowing a resolution enhancement from 250 nm to 45 nm within the last decade. Micro-optics also plays a decisive role in medical devices (endoscopes, ophthalmology), in all laser-based devices and fiber communication networks (supercomputer, ROADM), bringing high-speed internet to our homes (FTTH). Even our modern smart phones contain a variety of micro-optical elements. For example, LED flashlight shaping elements, the secondary camera, and ambient light and proximity sensors. Wherever light is involved, micro-optics offers the chance to further miniaturize a device, to improve its performance, or to reduce manufacturing and packaging costs. Wafer-scale micro-optics fabrication is based on technology established by semiconductor industry. Thousands of components are fabricated in parallel on a wafer. We report on the state of the art in wafer-based manufacturing, testing, packaging and present examples and applications for micro-optical components and systems.

Paper Details

Date Published: 26 November 2012
PDF: 12 pages
Proc. SPIE 8557, Optical Design and Testing V, 855702 (26 November 2012); doi: 10.1117/12.981779
Show Author Affiliations
Reinhard Voelkel, SUSS MicroOptics SA (Switzerland)
Li Gong, SUSS MicroTec Co. Ltd. (China)
Juergen Rieck, SUSS MicroOptics SA (Switzerland)
Alan Zheng, SUSS MicroTec Co. Ltd. (China)

Published in SPIE Proceedings Vol. 8557:
Optical Design and Testing V
Yongtian Wang; Chunlei Du; Hong Hua; Kimio Tatsuno; H. Paul Urbach, Editor(s)

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