Share Email Print
cover

Proceedings Paper

Defect management of EUV mask
Author(s): Takashi Kamo; Koji Murano; Kosuke Takai; Kazuki Hagihara; Shinji Yamaguchi; Masato Naka; Keiko Morishita; Ryoji Yoshikawa; Masamitsu Itoh; Suigen Kyoh; Naoya Hayashi
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Extreme Ultraviolet Lithography (EUVL) is a promising technology for the fabrication of ULSI devices with 20nm half-pitch node. One of the key challenges before EUVL is to achieve defect-free masks. There are three main categories of mask defects: multilayer defects which cause phase defects, absorber pattern defects, and particles during blank/mask fabrication or mask handling after mask fabrication. It is important to manage multilayer defect because small multilayer defects are difficult to be identified by SEM/AFM after mask patterning and can impact wafer printing. In this paper, we assess blank defect position error detected by 3rd generation blank inspection tool, using blank defect information from blank supplier and 199nm wavelength patterned mask inspection tool NPI-7000. And we rank blank defect in the order of projection defect size to multilayer in order to estimate blank defect printability. This method avoids overestimating the number of potential killer defects that hardly be identified by SEM/AFM under the condition that EUV-AIMS is not available.

Paper Details

Date Published: 30 June 2012
PDF: 6 pages
Proc. SPIE 8441, Photomask and Next-Generation Lithography Mask Technology XIX, 844118 (30 June 2012); doi: 10.1117/12.978976
Show Author Affiliations
Takashi Kamo, Toshiba Corp. (Japan)
Koji Murano, Toshiba Corp. (Japan)
Kosuke Takai, Toshiba Corp. (Japan)
Kazuki Hagihara, Toshiba Corp. (Japan)
Shinji Yamaguchi, Toshiba Corp. (Japan)
Masato Naka, Toshiba Corp. (Japan)
Keiko Morishita, Toshiba Corp. (Japan)
Ryoji Yoshikawa, Toshiba Corp. (Japan)
Masamitsu Itoh, Toshiba Corp. (Japan)
Suigen Kyoh, Toshiba Corp. (Japan)
Naoya Hayashi, Dai Nippon Printing Co., Ltd. (Japan)


Published in SPIE Proceedings Vol. 8441:
Photomask and Next-Generation Lithography Mask Technology XIX
Kokoro Kato, Editor(s)

© SPIE. Terms of Use
Back to Top