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Proceedings Paper

Mask process characterization of multiresolution writing
Author(s): Timothy Lin; Jed Rankin; Yuki Fujita; Adam C. Smith; Emile Sahouria; Ahmad Elayat; Peter Thwaite; Steffen Schulze
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Paper Abstract

Multiresolution writing refers to a technique used to simplify the data in one or more of the write passes performed by a vector-based e-beam writer while maintaining the detail in at least one of the remaining layers. This technique has been demonstrated to reduce the total shot count by as much as 30% with minimal predicted impact to the mask features formed, and no predicted impact to the wafer lithographic results. We investigate the impact of this technique on the mask manufacturing process. Specific mask parameters investigated include critical dimension uniformity, critical dimension proximity and linearity effects, line edge roughness, and mask inspectibility. Additional considerations include the applicability of this technique to existing mask designs as well as next generation RET solutions. This characterization identifies an operating regime where shot savings can be realized while still maintaining acceptable mask quality.

Paper Details

Date Published: 30 June 2012
PDF: 19 pages
Proc. SPIE 8441, Photomask and Next-Generation Lithography Mask Technology XIX, 84411E (30 June 2012); doi: 10.1117/12.978836
Show Author Affiliations
Timothy Lin, Mentor Graphics Corp. (United States)
Jed Rankin, IBM (United States)
Yuki Fujita, Toppan Photomasks, Inc. (United States)
Adam C. Smith, IBM (United States)
Emile Sahouria, Mentor Graphics Corp. (United States)
Ahmad Elayat, Mentor Graphics Corp. (United States)
Peter Thwaite, Mentor Graphics Corp. (United States)
Steffen Schulze, Mentor Graphics Corp. (United States)


Published in SPIE Proceedings Vol. 8441:
Photomask and Next-Generation Lithography Mask Technology XIX
Kokoro Kato, Editor(s)

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