Share Email Print

Proceedings Paper

An Affordable 128 X 128 InSb Hybrid Focal Plane Array
Author(s): John Blackwell; Steve Botts; Adela Laband; Harold Arnold
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The need for increased resolution and sensitivity in tactical IR systems applications has provided the impetus for the development of high performance second generation staring focal plane array technology. Previously, the availability of these focal plane array components has been limited and the costs associated with delivery of useful hardware have been high. Utilizing proven InSb detector technology and foundry silicon CMOS processes, a high performance, affordable hybrid focal plane array and support electronics system has been developed, with the cost being less than $3 per pixel. The 128 x 128 array of photovoltaic InSb detectors on 50μm centers is interfaced with the silicon readout by aligning and cold welding indium bumps on each detector with the corresponding indium bump on the silicon readout. The detector is then thinned so that it can be illuminated through the backside. The 128 x 128 channel signal processing integrated circuit performs the function of interfacing with the detectors, integrating the detector current, and multiplexing the the signals. It is fabricated using a standard double poly, single metal, p-well CMOS process. The detector elements achieve a high quantum efficiency response from less than 1 µm to greater than 5 μm with an optical fill factor of 90%. The hybrid focal plane array can operate to a maximum frame rate of 1,000 Hz. D* values at 1.7 x 1014 ph/cm2/sec illumination conditions approach the BLIP value of 9.4 x 1011 cm√Hz/Watt with a capacity of 4 x 107 carriers and a dynamic range of greater than 50,000. The devices operate with only 3 biases and 3 clocks.

Paper Details

Date Published: 8 January 1990
PDF: 7 pages
Proc. SPIE 1157, Infrared Technology XV, (8 January 1990); doi: 10.1117/12.978601
Show Author Affiliations
John Blackwell, Amber Engineering, Inc (United States)
Steve Botts, Amber Engineering, Inc (United States)
Adela Laband, Amber Engineering, Inc, (United States)
Harold Arnold, Amber Engineering, Inc, (United States)

Published in SPIE Proceedings Vol. 1157:
Infrared Technology XV
Irving J. Spiro, Editor(s)

© SPIE. Terms of Use
Back to Top