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Proceedings Paper

Failure And Yield Analysis Techniques For Readout Devices Tested In A High Throughput Automated Wafer Probing Environment
Author(s): Noel D. Jolivet; Lee D. Holoien
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Paper Abstract

Failure and yield analysis capabilities were developed for focal plane array (FPA) readout devices probe tested at wafer level instead of merely performing production rate testing and cataloging data. Innovative test strategies have been combined with software techniques to provide tools which accomplish these analyses while maintaining high throughput in test. This approach has been beneficial and valuable in saving test time when searching for hardware faults, investigating design susceptibilities, revealing foundry process variations from wafer to wafer and/or lot to lot, and creating a yield model for the parts tested. Testing of readout devices has historically been viewed as a major obstacle in high volume production of reliable components for focal plane systems. Thorough testing in a high throughput automated wafer probe environment may be achieved, but often at the expense of real-time analysis of failures and yield factors. Production testing has been established with these goals in mind rather than as an afterthought. This enables one to identify failure mechanisms as they occur in order to reduce yield loss and unnecessary test time. In addition to performing requisite data base management, routines have been created to re-sort data and reevaluate yield through varying performance parameter limits, to track and map failure mechanisms as they are encountered, to examine acquired data as a function of limits, and to provide yield information for feedback response to foundry processing. Ideas for aiding operators in recognizing and diagnosing possible test set hardware problems (as opposed to on-chip failures) have also been implemented.

Paper Details

Date Published: 8 January 1990
PDF: 10 pages
Proc. SPIE 1157, Infrared Technology XV, (8 January 1990); doi: 10.1117/12.978598
Show Author Affiliations
Noel D. Jolivet, Amber Engineering (United States)
Lee D. Holoien, Amber Engineering (United States)


Published in SPIE Proceedings Vol. 1157:
Infrared Technology XV
Irving J. Spiro, Editor(s)

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