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Proceedings Paper

Statistical Methodology For The Evaluation, Characterization And Optimization Of Dry Etch Modules
Author(s): Richard O. Lynch; Richard J. Markle
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Paper Abstract

Accelerated learning, improved process control and advanced manufacturability are high priorities at SEMATECH. This being the case, the effective use of such statistical techniques as the design of experiments, response surface methodology and statistical process control are also high priorities. We have developed and are using a generic module evaluation, characterization and optimization methodology that integrates the use of these statistical tools to accelerate and improve both the accomplishment of these tasks and that of climbing the learning curves for both the processing tool and its process. In this paper we describe an important portion of this methodology, Passive Data Collection. We will illustrate Passive Data Collection in dry etching with an example.

Paper Details

Date Published: 30 January 1990
PDF: 10 pages
Proc. SPIE 1185, Dry Processing for Submicrometer Lithography, (30 January 1990); doi: 10.1117/12.978059
Show Author Affiliations
Richard O. Lynch, Harris Corporation (United States)
Richard J. Markle, Sematech (United States)

Published in SPIE Proceedings Vol. 1185:
Dry Processing for Submicrometer Lithography
James A. Bondur; Alan R. Reinberg, Editor(s)

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