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Proceedings Paper

Laser beam shaping and packaging system
Author(s): Daxin Luo; Baiqin Zhao
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Paper Abstract

This paper presents a semiconductor laser beam shaping system, that can collimate the irradiance profile effectively and package the laser diode(LD) at the same time. Due to the semiconductor LD is a kind of line source, a particular ellipsoidal lens is designed after both the fast-axis and the slow-axis of the laser beam analyzed. Geometrical optics analysis based on the ray tracing method is done and the formulas to calculate the shape of the lens are given. Both the theoretical and experimental result show that the laser beam system works effectively; the divergence angle is reduced to less than 0.5 degree in the fast-axial direction and 1.8 degree in the slow-axial direction. In addition, it is the same process that makes the laser beam shaper and packages the LD by using epoxy resin, which simplifies the manufacturing process and reduces the LD volume greatly. Because of the advantages of small volume, low-cost, high rigidity and easy fabrication, the shaper is of great value in the field of semiconductor LD applications.

Paper Details

Date Published: 16 October 2012
PDF: 6 pages
Proc. SPIE 8416, 6th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 84161U (16 October 2012); doi: 10.1117/12.976862
Show Author Affiliations
Daxin Luo, Institute of Semiconductors (China)
Baiqin Zhao, Institute of Semiconductors (China)


Published in SPIE Proceedings Vol. 8416:
6th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies
Li Yang; Eric Ruch; Shengyi Li, Editor(s)

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