Share Email Print
cover

Proceedings Paper

Self Consistent Heat Load Evaluation Of Laser Diode Modules For High Temperature Operation
Author(s): Eric Y. Chan; C. C. Chen
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

An experimental approach to evaluate the heat load of a laser diode module has been performed. In this experiment, stable CW light output operation up to 125°C was achieved by adding an external high capacity thermoelectric cooler to the laser diode module. By monitoring the temperature of the laser diode package, the cold side of the thermoelectric cooler, the heat sink temperature, the ambient temperature and compare these temperature data with the performance curves of the thermoelectric cooler, we have identified that the major source of heat is from the laser diode package case. Heat is originated from both the ambient and the hot side of the thermoelectric cooler. Proper thermal design of the module package is important to the optimum performance of the laser diode in an actual operating environment. These results are of considerable significance for the development of temperature stable diode laser source for military and aerospace application.

Paper Details

Date Published: 22 June 1989
PDF: 7 pages
Proc. SPIE 1043, Laser Diode Technology and Applications, (22 June 1989); doi: 10.1117/12.976390
Show Author Affiliations
Eric Y. Chan, Boeing Electronic High Technology Center (United States)
C. C. Chen, Boeing Electronic High Technology Center (United States)


Published in SPIE Proceedings Vol. 1043:
Laser Diode Technology and Applications
Luis Figueroa, Editor(s)

© SPIE. Terms of Use
Back to Top