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Proceedings Paper

Opto-Mechanical Packaging For Extended Temperature Performance
Author(s): Scott Enochs
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Paper Abstract

The ability of a laser diode module package to maintain precise laser-to-fiber alignment with mechanical stress or temperature change is critical for stable performance. This paper examines an optical-mechanical package configuration in which both laser and fiber are mounted on the same surface with high-temperature solder, thereby minimizing degraded package performance caused by exteraneous thermal or mechanical changes.

Paper Details

Date Published: 22 June 1989
PDF: 6 pages
Proc. SPIE 1043, Laser Diode Technology and Applications, (22 June 1989); doi: 10.1117/12.976389
Show Author Affiliations
Scott Enochs, Tektronix, Inc. (United States)


Published in SPIE Proceedings Vol. 1043:
Laser Diode Technology and Applications
Luis Figueroa, Editor(s)

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