Proceedings PaperThree Dimensional Integrated Circuits Using Optical Interconnects
|Format||Member Price||Non-Member Price|
|GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free.||Check Access|
A three dimensional architecture is described using optical sources and detectors to interconnect integrated circuit layers. By stacking circuit planes and communicating through optical vias, substantial savings are realized in volume and cost along with increases in density and speed. Highly parallel architectures and efficient hardware for array processing are now possible using technologies that are rapidly becoming practical and available.