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Proceedings Paper

Prediction Of Shelf-Lives Of Positive Photoresists Based On Accelerated Aging Techniques Kinetic Evaluation Of Various Parameters
Author(s): G. Wijbenga; M. S. Chen; S. A. Fine
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Paper Abstract

An overview of a model for aging of positive photoresists is presented. Photoresist samples were held at different temperatures for varying periods of time. Physical and spectral properties were monitored to determine rates of change as a function of temperature. Since the resists contain photoactive diazonaphthoquinones, which slowly decompose when heated, photospeed and nitrogen evolution were measured to obtain information about the decomposition rates of the photoactive compounds. Kinetics of change of coating thickness, viscosity, contrast, unexposed thickness loss, Dill parameters, and CO2 evolution were also determined to better understand the aging process in resists.

Paper Details

Date Published: 17 September 1987
PDF: 17 pages
Proc. SPIE 0811, Optical Microlithographic Technology for Integrated Circuit Fabrication and Inspection, (17 September 1987); doi: 10.1117/12.975601
Show Author Affiliations
G. Wijbenga, Shipley Company (United States)
M. S. Chen, Shipley Company (United States)
S. A. Fine, Shipley Company (United States)


Published in SPIE Proceedings Vol. 0811:
Optical Microlithographic Technology for Integrated Circuit Fabrication and Inspection
Harry L. Stover; Stefan Wittekoek, Editor(s)

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