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Proceedings Paper

Research of communication mechanism based USB in wafer stage of lithography
Author(s): Zhuang Sheng; Xiaoping Tang; Jinglong Li
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Paper Abstract

Lithography occupies an important position in the development of integrated circuits. As a core component - the wafer stage is a high accuracy, real-time and large travel control important equipment, which has a significant impact on lithography alignment accuracy and exposure quality. The complexity of the wafer stage control and the real-time feedback of synchronization errors are the practical needs in high quality communication. As a general-purpose communication device—USB in various fields has a wide application, and its reliability has been sufficiently validated. In this paper, USB is used as data transmission device to achieve entire communication process. Grating data in FPGA is processed and transferred into host computer, and then it is used to do error analysis. Meanwhile the feedback of grating data from FPGA is aimed to promote the stage orientation precision. The host computer transfers data and custom command through USB to monitor the state of stage motion and guarantees the high-precision control.

Paper Details

Date Published: 15 October 2012
PDF: 6 pages
Proc. SPIE 8418, 6th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Smart Structures, Micro- and Nano-Optical Devices, and Systems, 841818 (15 October 2012); doi: 10.1117/12.973654
Show Author Affiliations
Zhuang Sheng, Institute of Optics and Electronics (China)
Graduate Univ. of Chinese Academy of Sciences (China)
Xiaoping Tang, Institute of Optics and Electronics (China)
Jinglong Li, Institute of Optics and Electronics (China)
Graduate Univ. of Chinese Academy of Sciences (China)


Published in SPIE Proceedings Vol. 8418:
6th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Smart Structures, Micro- and Nano-Optical Devices, and Systems
Tianchun Ye; Song Hu; Yanqiu Li; Xiangang Luo; Xiaoyi Bao, Editor(s)

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