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Proceedings Paper

Using the CESM Shell to Classify Wafer Defects from Visual Data
Author(s): Sung-Do Chi; Bernard P. Zeigler; Tag Gon Kim
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Paper Abstract

Automatic visual wafer inspection will increase productivity and improve product quality of integrated circuit (IC) chips on wafers. Recently, research on such inspection has been focused on problems for classification of defects on wafers to rectify wafer fabrication errors by comparing them with predefined specification standards. This paper describes the development of a knowledge-based system which classifies defects in the recti-linear type wafer images for VLSI chips. A consultation system shell called CESM (Classification Expert System Maker) has been used to develop the classification system. CESM supports integration of low level processing, feature extraction, and final decision stages.

Paper Details

Date Published: 1 February 1990
PDF: 12 pages
Proc. SPIE 1197, Automated Inspection and High-Speed Vision Architectures III, (1 February 1990); doi: 10.1117/12.969935
Show Author Affiliations
Sung-Do Chi, University of Arizona (United States)
Bernard P. Zeigler, University of Arizona (United States)
Tag Gon Kim, University of Arizona (United States)

Published in SPIE Proceedings Vol. 1197:
Automated Inspection and High-Speed Vision Architectures III
Michael J. W. Chen, Editor(s)

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