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Proceedings Paper

Vision Algorithms For VLSI Wafer Probing
Author(s): R. V. Dantu; R. V. Patel; N. J. Dimopoulos; A. J. Al-Khalili
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Paper Abstract

This paper deals with an important problem encountered in automating VLSI wafer probing. In this automation, vision is used for accurately guiding and lowering a probe to make contact with the wafer. In this paper, we discuss various algorithms used in measurement of the distance of the micro-manipulator from the wafer surface. In particular, we describe algorithms for alignment of consecutive frames of the wafer, separation of probe and wafer regions, and getting a clean image of the probe by eliminating traces of the background patterns. We also describe a three-level procedure for obtaining the proximity of the probe from the wafer. These algorithms are verified with the experimental data.

Paper Details

Date Published: 1 February 1990
PDF: 12 pages
Proc. SPIE 1197, Automated Inspection and High-Speed Vision Architectures III, (1 February 1990); doi: 10.1117/12.969934
Show Author Affiliations
R. V. Dantu, Concordia University (Canada)
R. V. Patel, Concordia University (Canada)
N. J. Dimopoulos, Concordia University (Canada)
A. J. Al-Khalili, Concordia University (Canada)

Published in SPIE Proceedings Vol. 1197:
Automated Inspection and High-Speed Vision Architectures III
Michael J. W. Chen, Editor(s)

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