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Proceedings Paper

Novel Chemical Amplification System in Azide/Phenolic Resin-Based Negative Resist
Author(s): Emiko Aoki; Hiroshi Shiraishi; Michiaki Hashimoto; Nobuaki Hayashi
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Paper Abstract

A novel chemical amplification system based on an azide/phenolic resin-based negative resist is described. The new resist, which consists of an azide, a phenolic resin matrix, and a carboxylic acid, can be developed in aqueous alkaline solutions. Electron-beam exposure of this resist results in the production of a primary amine. In a subsequent post-exposure baking step, the primary amine catalyzes decarboxylation of the carboxylic acid. Additionally, the decarboxylation product acts as an aqueous alkaline dissolution inhibitor in the exposed areas. On the other hand, the carboxylic acid remaining in the unexposed areas promotes the dissolution rate of those areas. The new resist shows non-swelling pattern-formation by using the aqueous alkaline developer, and the sensitivity to electron beams is about three times higher than that of MRS.

Paper Details

Date Published: 1 August 1989
PDF: 5 pages
Proc. SPIE 1089, Electron-Beam, X-Ray, and Ion-Beam Technology: Submicrometer Lithographies VIII, (1 August 1989); doi: 10.1117/12.968541
Show Author Affiliations
Emiko Aoki, Hitachi, Ltd. (Japan)
Hiroshi Shiraishi, Hitachi, Ltd. (Japan)
Michiaki Hashimoto, Yamazaki Works, Hitachi Chemical Co., Ltd. (Japan)
Nobuaki Hayashi, Hitachi, Ltd. (Japan)


Published in SPIE Proceedings Vol. 1089:
Electron-Beam, X-Ray, and Ion-Beam Technology: Submicrometer Lithographies VIII
Arnold W. Yanof, Editor(s)

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