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Proceedings Paper

Soft Vacuum Pulsed Electron Beam Processing Of Tenon And Teflon-Like Films
Author(s): J. Krishnaswamy; G. J. Collins; H. Hiraoka
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Paper Abstract

Poly(tetrafluoroethylene), Teflon, is an excellent engineering material with a low dielectric constant, chemical. inertness in hazardous environments, and thermal stability. However, it has many shortcomings such as poor adhesion to substrates, difficulty in micron-sized via hole fabrication, and almost zero solubility in common solvents. We found that Teflon self-developed very efficiently under pulsed electron beam (25 KV to 30 KV) exposure in soft vacuum. Teflon images were obtained by performing the electron exposure through a mask. its etching rate is the highest among the polymer films studied including radiation-sensitive poly(2-butene sulfone). A possible mechanism for this high self-development rate is proposed.

Paper Details

Date Published: 1 August 1989
PDF: 5 pages
Proc. SPIE 1089, Electron-Beam, X-Ray, and Ion-Beam Technology: Submicrometer Lithographies VIII, (1 August 1989); doi: 10.1117/12.968539
Show Author Affiliations
J. Krishnaswamy, Colorado State University (United States)
G. J. Collins, Colorado State University (United States)
H. Hiraoka, IBM Almaden Research Center (United States)

Published in SPIE Proceedings Vol. 1089:
Electron-Beam, X-Ray, and Ion-Beam Technology: Submicrometer Lithographies VIII
Arnold W. Yanof, Editor(s)

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