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Proceedings Paper

Infrared Thermography For Process Control
Author(s): Gregory P. Winsor
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Paper Abstract

Traditionally, Infrared Thermography, when used for printed circuit board applications, has been used only as a tool to isolate defects in printed circuit boards so that they may be repaired and returned to the manufacturing line. There are many processes involved in the manufacturing of printed circuit boards, all of which must be under control to ensure the manufacturability of a quality product. Process excursions result in defective boards that may or may not be able to be repaired. Those that are repairable are generally repaired at a substantial expense. This large expense is justifiable due to the fact that many of today's printed circuit boards are complex, multi-layered printed circuit boards which are very expensive to manufacture and therefore, represent a substantial investment in the final form. Infrared Thermography may be utilized, not only as a tool to locate defects within a product, but also as a tool for process control for the identification of process excursions, however infrequent. With adequate identification methods and proper communications within the manufacturing environment, these process excursions can be identified and resolved with minimum manufacturing impact. This paper addresses the impact Infrared Thermography has had on process control at one particular plant, and how others may utilize these tools to facilitate process controls for their individual applications.

Paper Details

Date Published: 1 January 1988
PDF: 6 pages
Proc. SPIE 0934, Thermosense X: Thermal Infrared Sensing for Diagnostics and Control, (1 January 1988); doi: 10.1117/12.968490
Show Author Affiliations
Gregory P. Winsor, IBM Corporation (United States)


Published in SPIE Proceedings Vol. 0934:
Thermosense X: Thermal Infrared Sensing for Diagnostics and Control
Ronald D. Lucier, Editor(s)

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