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Proceedings Paper

Seamless Stitching For Large Area Integrated Circuit Manufacturing
Author(s): James P. Rominger
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Paper Abstract

A novel approach to printing large area integrated circuits (having a surface area larger than the nominal field and submicron geometries) through joining two or more stepped image fields was tested for feasibility. A "superfield" of 30 mm by 30 mm was printed which combined three exposures of a nominal 30 mm by 10 mm field on a lx stepper. Tapering the illumination across the common border region between the over-lapping "subfields" blended one into another. This technique also minimized the effects of misalignment and uneven exposure between fields and preserved the minimum resolution of the lens system in all areas of the stitched superfield.

Paper Details

Date Published: 1 January 1988
PDF: 6 pages
Proc. SPIE 0922, Optical/Laser Microlithography, (1 January 1988); doi: 10.1117/12.968412
Show Author Affiliations
James P. Rominger, Ultratech Stepper (United States)

Published in SPIE Proceedings Vol. 0922:
Optical/Laser Microlithography
Burn Jeng Lin, Editor(s)

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