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Proceedings Paper

New Advances In Reticle Qualification Techniques
Author(s): James A. Reynolds; Magnus O.W. Ryde; Henry H. Kim
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Paper Abstract

A key challenge in integrated circuit manufacture is to transfer images onto silicon wafers without introducing defects. Image qualification (IQ) is the technique used to assure that no repeating defects are transferred from the reticle to the lx wafer image. Increasing design complexities and smaller feature sizes make automated inspection a necessity. The most common IQ technique involves imaging a metal-coated glass wafer (aluminum 1 or chrome2) and automatically inspecting it using traditional mask and reticle inspection equipment. This method requires additional processing steps (metal etching and stripping) not commonly employed in a wafer fab area to prepare develop-inspect samples. A new technique is now available which more closely matches standard wafer fab processing and eliminates the need for metal etching by allowing direct automatic inspection of developed resist images on a quartz wafer (ROQ) substrate. In this paper, the ROQ equipment and process are discussed and inspection results are compared to conventional metal film results. The concepts of defect fidelity function and effective defect capture rates are used for comparison between the two techniques4.

Paper Details

Date Published: 1 January 1988
PDF: 17 pages
Proc. SPIE 0922, Optical/Laser Microlithography, (1 January 1988); doi: 10.1117/12.968400
Show Author Affiliations
James A. Reynolds, Reynolds Consulting (United States)
Magnus O.W. Ryde, KLA Instruments (United States)
Henry H. Kim, Ultratech Stepper (United States)


Published in SPIE Proceedings Vol. 0922:
Optical/Laser Microlithography
Burn Jeng Lin, Editor(s)

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