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Proceedings Paper

Automated Defect Inspection: A Valuable Tool For Proactive Defect Control
Author(s): Michael Cherniawski; Kam-shui Chan
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Paper Abstract

Defect control in a VLSI production facility is a critical activity for establishing stability and improvement in final die yield. A key aspect of any defect control program is visual inspection of product wafers during their manufacture. Traditionally this has been executed by operators. However, a visual inspection program utilizing automated defect detection equipment has been developed and will be described in this paper. The program places emphasis on monitoring and detecting defects as they occur. The bulk of the inspections are done on critical layers (i.e. layers with a high density of printed and etched patterns) as they will be most susceptible to yield loss. A highly controlled classification system along with proper training of operators is used to maintain the integrity of the collected defect data. A flexible data base, in which the defect data is entered, is used to maximize the analysis techniques that can be applied with this inspection program. Finally, examples of successful application of the program will be described.

Paper Details

Date Published: 1 January 1988
PDF: 7 pages
Proc. SPIE 0921, Integrated Circuit Metrology, Inspection, and Process Control II, (1 January 1988); doi: 10.1117/12.968370
Show Author Affiliations
Michael Cherniawski, Motorola Inc (United States)
Kam-shui Chan, Motorola Inc (United States)


Published in SPIE Proceedings Vol. 0921:
Integrated Circuit Metrology, Inspection, and Process Control II
Kevin M. Monahan, Editor(s)

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