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Proceedings Paper

Laser Scanning Optical Inspection And Metrology
Author(s): R. W. Wijnaendts-van-Resandt; Th. Zapf; M. Fangerau; R. Piepenstock
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Paper Abstract

Confocal Laser Scanning Microscopy is becoming an important tool in the quantitative analysis of submicron structures in the field of in-process critical dimension measurements. In addition, this kind of microscopy possesses great potential for applications in automatic defect detection. Special microscope systems for critical dimension measurements have been reported in several areas in semiconductor research and fabrication (1, 2, 3, 4). The technical realization of these systems is based on two different principles: the beam scanning microscopes and the object scanning microscopes. The purpose of this contribution is to present some of the technical details and possibilities of a fully automated beam scanning microscope for VLSI metrology. Furthermore, the first results of an automatic wafer defect inspection system based on the same technology are presented.

Paper Details

Date Published: 1 January 1988
PDF: 7 pages
Proc. SPIE 0921, Integrated Circuit Metrology, Inspection, and Process Control II, (1 January 1988); doi: 10.1117/12.968354
Show Author Affiliations
R. W. Wijnaendts-van-Resandt, Heidelberg Instruments GmbH (Germany)
Th. Zapf, Heidelberg Instruments GmbH (Germany)
M. Fangerau, Heidelberg Instruments GmbH (Germany)
R. Piepenstock, Heidelberg Instruments GmbH (Germany)


Published in SPIE Proceedings Vol. 0921:
Integrated Circuit Metrology, Inspection, and Process Control II
Kevin M. Monahan, Editor(s)

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