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Proceedings Paper

A New Silicone-Based Positive Photoresist (SPP) For A Two-Layer Resist System
Author(s): Saburo Imamura; Akinobu Tanaka; Katsuhide Onose
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Paper Abstract

A new silicone-based positive photoresist(SPP), composed of an alkali-soluble silicone polymer with diazonaphthoquinone, is developed. The sensitivity of SPP to near-uv light is almost the same as that of conventional photoresist(OFPR). SPP shows high dry-etching durability to 02 RIE. The etching rate ratio of SPP to OFPR is over 20. This high dry-etching durability allows the fabrication of thick OFPR resist patterns using an SPP pattern mask. A 0.6 μm line and space is clearly resolved in an SPP/OFPR resist system when exposed to a GCA stepper (NA=0.38)

Paper Details

Date Published: 1 January 1988
PDF: 4 pages
Proc. SPIE 0920, Advances in Resist Technology and Processing V, (1 January 1988); doi: 10.1117/12.968330
Show Author Affiliations
Saburo Imamura, NTT Basic Research Laboratories (Japan)
Akinobu Tanaka, NTT LSI Laboratories (Japan)
Katsuhide Onose, NTT Optoelectronics Laboratories (Japan)

Published in SPIE Proceedings Vol. 0920:
Advances in Resist Technology and Processing V
Scott A. MacDonald, Editor(s)

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