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Proceedings Paper

Lithographic, Photochemical And O[sub]2[/sub] RIE Properties Of Three Polysilane Copolymers
Author(s): Gary N. Taylor; Molly Y. Hellman; Thomas M. Wolf; John M. Zeigler
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Paper Abstract

Polysilanes are high Si-content polymers containing backbone Si-Si bonds. Their high Si content makes them very resistant to removal by 02 reactive ion etching (RIE) while their Si-Si bonding results in strong transitions in the mid- and deep-UV regions. Mid-UV photolysis causes chain scission, a process used by IBM workers in two lithographic applications: as imaging layers in organometallic bilevel, 02-RIE-developed resistsl and as contrast enhancement materials for imaging with positive photoresists.

Paper Details

Date Published: 1 January 1988
PDF: 17 pages
Proc. SPIE 0920, Advances in Resist Technology and Processing V, (1 January 1988); doi: 10.1117/12.968329
Show Author Affiliations
Gary N. Taylor, AT&T Bell Laboratories (United States)
Molly Y. Hellman, AT&T Bell Laboratories (United States)
Thomas M. Wolf, AT&T Bell Laboratories (United States)
John M. Zeigler, Sandia National Laboratories (United States)

Published in SPIE Proceedings Vol. 0920:
Advances in Resist Technology and Processing V
Scott A. MacDonald, Editor(s)

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