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Proceedings Paper

Silicon-Added Bilayer Resist (SABRE) System
Author(s): William C. McColgin; Robert C. Daly; Joseph Jech; Thomas B. Brust
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Paper Abstract

A new silylated resist process has been developed that provides the advantages of trilayer photoresist processing in a simpler bilayer format. In this new process, silicon for oxygen plasma etch resistance is added to a conventional photoresist layer after it has been exposed and developed. This silylated resist image provides an etch mask for 02 RIE etching of an underlying organic planarizing layer with 15:1 selectivity, vertical profiles, and high resolution. The process is positive-working, uses conventional materials, and improves the thermal stability of the resist image.

Paper Details

Date Published: 1 January 1988
PDF: 8 pages
Proc. SPIE 0920, Advances in Resist Technology and Processing V, (1 January 1988); doi: 10.1117/12.968327
Show Author Affiliations
William C. McColgin, Eastman Kodak Company (United States)
Robert C. Daly, Eastman Kodak Company (United States)
Joseph Jech, Eastman Kodak Company (United States)
Thomas B. Brust, Eastman Kodak Company (United States)


Published in SPIE Proceedings Vol. 0920:
Advances in Resist Technology and Processing V
Scott A. MacDonald, Editor(s)

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