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Proceedings Paper

Thermal Processing Of Resist Materials: A Kinetic Approach
Author(s): David H. Ziger; Gary L. Wolk
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Paper Abstract

A kinetic approach to thermal processing of labile resist materials is proposed which compensates for non-isothermal heat treatments, run to run thermal variations and batch loading effects. This technique was used to control ammonia catalyzed image reversal processing and allowed consistent definition of 0.5μm and 0.6μm linear features using a g-line stepper equipped with 0.42 and 0.35 NA lenses respectively.

Paper Details

Date Published: 1 January 1988
PDF: 6 pages
Proc. SPIE 0920, Advances in Resist Technology and Processing V, (1 January 1988); doi: 10.1117/12.968322
Show Author Affiliations
David H. Ziger, AT&T Engineering Research Center (United States)
Gary L. Wolk, AT&T Engineering Research Center (United States)

Published in SPIE Proceedings Vol. 0920:
Advances in Resist Technology and Processing V
Scott A. MacDonald, Editor(s)

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